Search Results - "Singleton, Laurence Edward" :: K.UTB vyhledávací portál

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Semiconductor device with different conductive features embedded in a mold enclosing a semiconductor die and method for making same

by Simon, Juergen, Singleton, Laurence Edward
Year of Publication 10.08.2010

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Semiconductor device with different conductive features embedded in a mold enclosing a semiconductor die and method for making same

by SIMON JUERGEN, SINGLETON LAURENCE EDWARD
Year of Publication 10.08.2010

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Semiconductor Device and Method for Making Same

by SIMON JUERGEN, SINGLETON LAURENCE EDWARD
Year of Publication 02.04.2009

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Semiconductor chip for use in semiconductor chip stack, has solder material applied on front side in form of solder balls on plugs and intermediate spaces between balls are filled with concrete joint sealing compound on semiconductor wafer

by SIMON, JUERGEN, SINGLETON, LAURENCE EDWARD
Year of Publication 17.04.2008

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Die arrangement and method for producing a die arrangement

by THOMAS JOCHEN, SIMON JUERGEN, SINGLETON LAURENCE EDWARD
Year of Publication 03.04.2008

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Chip e.g. pure silicon wafer, manufacturing method for use during e.g. assembly of ball grid array component, involves providing chip with contact surface, applying contact bump on contact surface, and applying soldering material on bump

by IRSIGLER, ROLAND, HEDLER, HARRY, SINGLETON, LAURENCE EDWARD
Year of Publication 29.11.2007

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Stack of semiconductor chips

by WOLLANKE ALEXANDER, SINGLETON LAURENCE EDWARD, BELONIO JESUS MENNEN
Year of Publication 23.02.2010

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Stack of semiconductor chips

by Singleton, Laurence Edward, Wollanke, Alexander, Belonio, Jesus Mennen
Year of Publication 23.02.2010

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STACKING OF SEMICONDUCTOR CHIPS

by WOLLANKE ALEXANDER, SINGLETON LAURENCE EDWARD, BELONIO JESUS MENNEN
Year of Publication 09.08.2007

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Production of semiconductor element, e.g. for use in mobile telephones, includes forming projections of differing elasticity modulus by selective illumination of photopolymerizable compositions

by MEYER, TORSTEN, HEDLER, HARRY, DOBRITZ, STEPHAN, SINGLETON, LAURENCE EDWARD
Year of Publication 22.03.2007

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Semiconductor chip, semiconductor chip stack and stacking mathod thereof

by SIMON, JUERGEN, SINGLETON, LAURENCE EDWARD
Year of Publication 01.05.2008

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Method of assembling component on substrate

by SINGLETON, LAURENCE EDWARD, REISS, MARTIN
Year of Publication 16.03.2008

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Die arrangement and method for producing a die arrangement

by THOMAS JOCHEN, SIMON JUERGEN, SINGLETON LAURENCE EDWARD
Year of Publication 02.04.2008

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Die arrangement and method for producing a die arrangement

by TROVARELLI, OCTAVIO, SIMON, JUERGEN, THOMAS, JOCHEN, SINGLETON, LAURENCE EDWARD
Year of Publication 01.07.2008

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