Impact of electrode surface modulation on time-dependent dielectric breakdown
Kong Boon Yeap, Tian Shen, Zhang, Galor Wenyi, Sing Fui Yap, Holt, Brian, Gondal, Arfa, Seungman Choi, San Leong Liew, Yao, Walter, Justison, Patrick
Published in 2015 IEEE International Reliability Physics Symposium (01.04.2015)
Published in 2015 IEEE International Reliability Physics Symposium (01.04.2015)
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Conference Proceeding
Novel stress-free Keep Out Zone process development for via middle TSV in 20nm planar CMOS technology
Rabie, Mohamed A., Premachandran, C. S., Ranjan, Rakesh, Natarajan, Mahadevan Iyer, Sing Fui Yap, Smith, Daniel, Thangaraju, Sarasvathi, Alapati, Ramakanth, Benistant, Francis
Published in IEEE International Interconnect Technology Conference (01.05.2014)
Published in IEEE International Interconnect Technology Conference (01.05.2014)
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Conference Proceeding
Wafer level high temperature reliability study by backside probing f or a 50um thin TSV wafer
Premachandran, C. S., Ranjan, Rakesh, Agarwal, Rahul, Yap Sing Fui, Paliwoda, Peter, Sarasvathi, Thangaraju, Arfa, Gondal, Patrick, Justison, Mahadeva Iyer, Natarajan
Published in 2015 IEEE 65th Electronic Components and Technology Conference (ECTC) (01.05.2015)
Published in 2015 IEEE 65th Electronic Components and Technology Conference (ECTC) (01.05.2015)
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Conference Proceeding
A study of neuropsychiatric manifestations in COVID-19 infection in inpatients and its long-term outcomes in Malaysia
Chow, S K, Yap, D F S, Sim, J H, Tan, P S, Hee, N K Y, Teow, X M, Azreeni, N, Arina, H, Chin, P W
Published in Medical journal of Malaysia (01.12.2023)
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Published in Medical journal of Malaysia (01.12.2023)
Journal Article