Through Mold Vertical Interconnect Formation in FOWLP using conductive paste
Siew Boon, Serine Soh, David Ho, Soon Wee, Jaafar, Norhanani
Published in 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC) (05.12.2023)
Published in 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC) (05.12.2023)
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Conference Proceeding
Fine-Pitch RDL Integration for Fan-Out Wafer-Level Packaging
Lianto, Prayudi, Tan, Chin Wei, Jie Peng, Qi, Jumat, Abdul Hakim, Dai, Xundong, Peter Fung, Khai Mum, Huei See, Guan, Chong, Ser Choong, Wee David Ho, Soon, Serine Soh, Siew Boon, Huang Sharon Lim, Seow, Calvin Chua, Hung Ming, Abdillah Haron, Ahmad, Kenneth Lee, Huan Ching, Zhang, Mingsheng, Ko, Zhi Hao, Ko San, Ye, Leong, Henry
Published in 2020 IEEE 70th Electronic Components and Technology Conference (ECTC) (01.06.2020)
Published in 2020 IEEE 70th Electronic Components and Technology Conference (ECTC) (01.06.2020)
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Conference Proceeding
Wafer Level Package with Polymer Sealed Air Cavity
Ho, Soon Wee, Siew Boon, Serine Soh, Long, Lau Boon, Hsiang-Yao, Hsiao
Published in 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC) (07.12.2022)
Published in 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC) (07.12.2022)
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Conference Proceeding
Low Temperature Oxide Passivation for Via-last/backside process
Boon, Serine Soh Siew, Ho, Soon Wee, Bin, Wang Zong, Keat, Chia Ching
Published in 2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC) (07.12.2021)
Published in 2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC) (07.12.2021)
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Conference Proceeding
Low Temperature Physical Vapour Deposited Cu Seed Layer for Temporary Bonded Wafer Substrates
Yeo, Abdul Hannan, Boon, Serine Soh Siew, Wee, David Ho Soon, Shee, Kalyn Lim Tien, Qi, Wei Jun, Kang, Zhang, Ming, Kelvin Boh Tai, Ting, Cheng
Published in 2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC) (07.12.2021)
Published in 2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC) (07.12.2021)
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Conference Proceeding
Development of Antenna on FO-WLP
Boon, Serine Soh Siew, Wee, David Ho Soon, Yao, Hsiao Hsiang, Boon, Simon Lim Siak, Shan, Sharon Lim Pei, Choong, Chong Ser, Chong, Chai Tai
Published in 2018 IEEE 20th Electronics Packaging Technology Conference (EPTC) (01.12.2018)
Published in 2018 IEEE 20th Electronics Packaging Technology Conference (EPTC) (01.12.2018)
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Conference Proceeding
Impact of different developer concentrations for advanced packaging photolithography
Boon, Serine Soh Siew, Sek Soon Ann, King Jien Chui, Mingbin Yu
Published in 2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC) (01.12.2015)
Published in 2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC) (01.12.2015)
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Conference Proceeding
Effect of copper roughness on dielectric adhesion
Boon, Serine Soh Siew, Ho, S. W. David, Ding Liang, Sek Soon Ann
Published in 2014 IEEE 16th Electronics Packaging Technology Conference (EPTC) (01.12.2014)
Published in 2014 IEEE 16th Electronics Packaging Technology Conference (EPTC) (01.12.2014)
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Conference Proceeding