Thermal curing of hydrogen silsesquioxane
SIEW, Y. K, SARKAR, G, HU, X, HUI, J, SEE, A, CHUA, C. T
Published in Journal of the Electrochemical Society (2000)
Published in Journal of the Electrochemical Society (2000)
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In-situ scanning electron microscope observation of electromigration-induced void growth in 30 nm ½ pitch Cu interconnect structures
Vanstreels, K., Czarnecki, P., Kirimura, T., Siew, Y. K., De Wolf, I., Bömmels, J., Tőkei, Zs, Croes, K.
Published in Journal of applied physics (21.02.2014)
Published in Journal of applied physics (21.02.2014)
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Study of void formation kinetics in Cu interconnects using local sense structures
Croes, K, Lofrano, M, Wilson, C J, Carbonell, L, Siew, Y K, Beyer, G P, Tokei, Z
Published in 2011 International Reliability Physics Symposium (01.04.2011)
Published in 2011 International Reliability Physics Symposium (01.04.2011)
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Conference Proceeding
First Monolithic Integration of 3D Complementary FET (CFET) on 300mm Wafers
Subramanian, S., Hosseini, M., Chiarella, T., Sarkar, S., Schuddinck, P., Chan, B. T., Radisic, D., Mannaert, G., Hikavyy, A., Rosseel, E., Sebaai, F., Peter, A., Hopf, T., Morin, P., Wang, S., Devriendt, K., Batuk, D., Martinez, G. T., Veloso, A., Litta, E. Dentoni, Baudot, S., Siew, Y. K., Zhou, X., Briggs, B., Capogreco, E., Hung, J., Koret, R., Spessot, A., Ryckaert, J., Demuynck, S., Horiguchi, N., Boemmels, J.
Published in 2020 IEEE Symposium on VLSI Technology (01.06.2020)
Published in 2020 IEEE Symposium on VLSI Technology (01.06.2020)
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Conference Proceeding
High performance strained Germanium Gate All Around p-channel devices with excellent electrostatic control for sub-Jtlnm LG
Capogreco, E., Arimura, H., Witters, L., Vohra, A., Porret, C., Loo, R., De Keersgieter, A., Dupuy, E., Marinov, D., Hikavyy, A., Sebaai, F., Mannaert, G., Ragnarsson, L.-A., Siew, Y. K., Vrancken, C., Opdebeeck, A., Mitard, J., Langer, R., Sanchez, E. Altamirano, Holstetns, F., Demuynck, S., Barla, K., De Heyn, V., Mocuta, D., Collaert, N., Horiguchi, N.
Published in 2019 Symposium on VLSI Technology (01.06.2019)
Published in 2019 Symposium on VLSI Technology (01.06.2019)
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Conference Proceeding
Full reliability study of advanced metallization options for 30 nm one half pitch interconnects
Croes, K, Demuynck, S, Siew, Y K, Pantouvaki, M, Wilson, C J, Heylen, N, Beyer, G P, Toekei, Z
Published in Microelectronic engineering (01.06.2013)
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Published in Microelectronic engineering (01.06.2013)
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Copper electromigration failure times evaluated over a wide range of voiding phases
Yunlong Li, Croes, K., Kirimura, T., Siew, Y. K., Tokei, Z.
Published in 2012 IEEE International Reliability Physics Symposium (IRPS) (01.04.2012)
Published in 2012 IEEE International Reliability Physics Symposium (IRPS) (01.04.2012)
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Conference Proceeding
Reliability Characterization of BEOL Vertical Natural Capacitor using Copper and Low-k SiCOH Dielectric for 65nm RF and Mixed-Signal Applications
Chen, F., Ungar, F., Fischer, A.H., Gill, J., Chinthakindi, A., Goebel, T., Shinosky, M., Coolbaugh, D., Ramachandran, V., Siew, Y.K., Kaltalioglu, E., Kim, S.O., Park, K.
Published in 2006 IEEE International Reliability Physics Symposium Proceedings (01.03.2006)
Published in 2006 IEEE International Reliability Physics Symposium Proceedings (01.03.2006)
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Conference Proceeding
Cu Wire resistance improvement using Mn-based Self-Formed Barriers
Siew, Y. K., Jourdan, N., Ciofi, I., Croes, K., Wilson, C. J., Tang, B. J., Demuynck, S., Wu, Z., Ai, H., Cellier, D., Cockburn, A., Bömmels, J., Tökei, Zs
Published in IEEE International Interconnect Technology Conference (01.05.2014)
Published in IEEE International Interconnect Technology Conference (01.05.2014)
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Conference Proceeding
CVD Mn-based self-formed barrier for advanced interconnect technology
Siew, Y. K., Jourdan, N., Barbarin, Y., Machillot, J., Demuynck, S., Croes, K., Tseng, J., Ai, H., Tang, J., Naik, M., Wang, P., Narasimhan, M., Abraham, M., Cockburn, A., Bommels, J., Tokei, Zs
Published in 2013 IEEE International Interconnect Technology Conference - IITC (01.06.2013)
Published in 2013 IEEE International Interconnect Technology Conference - IITC (01.06.2013)
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Conference Proceeding
Void nucleation and growth during electromigration in 30 nm wide Cu lines: Impact of different interfaces on failure mode
Kirimura, T., Croes, K., Siew, Y. K., Vanstreels, K., Czarnecki, P., Ei-Mekki, Z., van der Veen, M. H., Dictus, D., Yoon, A., Kolics, A., Bommcls, J., Tokei, Zs
Published in 2013 IEEE International Interconnect Technology Conference - IITC (01.06.2013)
Published in 2013 IEEE International Interconnect Technology Conference - IITC (01.06.2013)
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Conference Proceeding
Reliability performance of advanced metallization options for 30nm ½ pitch in SiCOH low-k materials
Croes, K., Demuynck, S., Siew, Y. K., Wilson, C. J., Heylen, N., Beyer, G. P., Tokei, Z.
Published in 2011 IEEE International Interconnect Technology Conference (01.05.2011)
Published in 2011 IEEE International Interconnect Technology Conference (01.05.2011)
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Conference Proceeding
65nm cmos technology for low power applications
Steegen, A., Mo, R., Mann, R., Sun, M.-C., Eller, M., Leake, G., Vietzke, D., Tilke, A., Guarin, F., Fischer, A., Pompl, T., Massey, G., Vayshenker, A., Tan, W.L., Ebert, A., Lin, W., Gao, W., Lian, J., Kim, J.-P., Wrschka, P., Yang, J.-H., Ajmera, A., Knoefler, R., Teh, Y.-W., Jamin, F., Park, J.E., Hooper, K., Griffin, C., Nguyen, P., Klee, V., Ku, V., Baiocco, C., Johnson, G., Tai, L., Benedict, J., Scheer, S., Zhuang, H., Ramanchandran, V., Matusiewicz, G., Lin, Y.-H., Siew, Y.K., Zhang, F., Leong, L.S., Liew, S.L., Park, K.C., Lee, K.-W., Hong, D.H., Choi, S.-M., Kaltalioglu, E., Kim, S.O., Naujok, M., Sherony, M., Cowley, A., Thomas, A., Sudijohno, J., Schiml, T., Ku, J.-H., Yang, I.
Published in IEEE InternationalElectron Devices Meeting, 2005. IEDM Technical Digest (2005)
Published in IEEE InternationalElectron Devices Meeting, 2005. IEDM Technical Digest (2005)
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Conference Proceeding
Yield & Reliability challenges of BEOL Interconnects
Tan, J.B., Seet, C.S., Zhang, H., Lim, S.K., Chua, S.T., Ismail, Z., Seah, B.M., Ee, P.Y., Vigar, D., Hsia, L.C., Zhang, B.C., Tang, T.J., Perera, C., Lim, Y.K., Siew, Y.K., Ee, Y.C., Lu, W., Liu, H.
Published in 2006 International Interconnect Technology Conference (2006)
Published in 2006 International Interconnect Technology Conference (2006)
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Conference Proceeding
Integration and reliability of a manufacturable 130nm dual damascene Cu/low-k process
Lee, T.J., Lim, Y.K., Zhang, F., Tan, D., Siew, Y.K., Perera, C., Bu, X.M., Chong, D., Vigar, D., Sun, S.C.
Published in Proceedings. 7th International Conference on Solid-State and Integrated Circuits Technology, 2004 (2004)
Published in Proceedings. 7th International Conference on Solid-State and Integrated Circuits Technology, 2004 (2004)
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Conference Proceeding
Integration of a poisoning-free dual damascene CDO film stack for 90 nm & beyond low-k BEOL
Wu Ping Liu, Juan Boon Tan, Wei Lu, Shyam Pal, Yong Kong Siew, Hai Cong, Bei Chao Zhang, Xian Bin Wang, Fan Zhang, Liang Choo Hsia
Published in IEEE VLSI-TSA International Symposium on VLSI Technology, 2005. (VLSI-TSA-Tech) (2005)
Published in IEEE VLSI-TSA International Symposium on VLSI Technology, 2005. (VLSI-TSA-Tech) (2005)
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Conference Proceeding