Predictive simulation of CDM events to study effects of package, substrate resistivity and placement of ESD protection circuits on reliability of integrated circuits
Shukla, Vrashank, Jack, Nathan, Rosenbaum, Elyse
Published in 2010 IEEE International Reliability Physics Symposium (01.05.2010)
Published in 2010 IEEE International Reliability Physics Symposium (01.05.2010)
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Conference Proceeding
CDM-ESD induced damage in components using stacked-die packaging
Olson, N., Jack, N., Shukla, V., Rosenbaum, E.
Published in 2011 IEEE Custom Integrated Circuits Conference (CICC) (01.09.2011)
Published in 2011 IEEE Custom Integrated Circuits Conference (CICC) (01.09.2011)
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Conference Proceeding
Test Chip design for study of CDM related failures in SoC designs
Olson, N, Shukla, V, Rosenbaum, E
Published in 2011 International Reliability Physics Symposium (01.04.2011)
Published in 2011 International Reliability Physics Symposium (01.04.2011)
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Conference Proceeding
2013 Best Student Paper Award
Shukla, Vrashank, Rosenbaum, Elyse, Boselli, Gianluca, Dissegna, Mariano, Duvvury, Charvaka, Sankaralingam, Raj
Published in 2015 37th Electrical Overstress/Electrostatic Discharge Symposium (EOS/ESD) (01.09.2015)
Published in 2015 37th Electrical Overstress/Electrostatic Discharge Symposium (EOS/ESD) (01.09.2015)
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Conference Proceeding
Predictive modeling of peak discharge current during charged device model test of microelectronic components
Shukla, Vrashank, Boselli, Gianluca, Dissegna, Mariano, Duvvury, Charvaka, Sankaralingam, Raj, Rosenbaum, Elyse
Published in 2013 35th Electrical Overstress/Electrostatic Discharge Symposium (01.09.2013)
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Published in 2013 35th Electrical Overstress/Electrostatic Discharge Symposium (01.09.2013)
Conference Proceeding
ESD protection networks for 3D integrated circuits
Rosenbaum, E., Shukla, V., Min-Sun Keel
Published in 2011 IEEE International 3D Systems Integration Conference (3DIC), 2011 IEEE International (01.01.2012)
Published in 2011 IEEE International 3D Systems Integration Conference (3DIC), 2011 IEEE International (01.01.2012)
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Conference Proceeding
CDM simulation study of a system-in-package
Shukla, V, Rosenbaum, E
Published in Electrical Overstress/Electrostatic Discharge Symposium Proceedings 2010 (01.10.2010)
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Published in Electrical Overstress/Electrostatic Discharge Symposium Proceedings 2010 (01.10.2010)
Conference Proceeding
Investigation of current flow during wafer-level CDM using real-time probing
Jack, N, Shukla, V, Rosenbaum, E
Published in Electrical Overstress/Electrostatic Discharge Symposium Proceedings 2010 (01.10.2010)
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Published in Electrical Overstress/Electrostatic Discharge Symposium Proceedings 2010 (01.10.2010)
Conference Proceeding
Charged Device Model Reliability of Three-Dimensional Integrated Circuits
Shukla, Vrashank, Rosenbaum, Elyse
Published in IEEE transactions on device and materials reliability (01.12.2015)
Published in IEEE transactions on device and materials reliability (01.12.2015)
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Magazine Article
Workshop and panel discussions
Wong, Rick, Miller, James, Vinson, Jim, Vashchenko, Vladislav, Anderson, Warren, Smedes, Theo, Karp, James, Pelc, Tom, Kinnear, John, Monroe, Gene, Peachey, Nathaniel, Gossner, Harald, Caignet, Fabrice, Klein, David, Stadler, Wolfgang, Johnson, Marty, Ashton, Robert, Righter, Alan, Gaertner, Reinhold, Kraz, Vladimir, Kaschani, Karim, Strickland, Matt, Linten, Dimitri, Shukla, Vrashank, Chaine, Mike, Lee, Jam-Wem, Gauthier, Robert
Published in 2013 35th Electrical Overstress/Electrostatic Discharge Symposium (01.09.2013)
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Published in 2013 35th Electrical Overstress/Electrostatic Discharge Symposium (01.09.2013)
Conference Proceeding
Prediction of Charged Device Model Peak Discharge Current for Microelectronic Components
Shukla, Vrashank, Boselli, Gianluca, Dissegna, Mariano, Duvvury, Charvaka, Sankaralingam, Raj, Rosenbaum, Elyse
Published in IEEE transactions on device and materials reliability (01.09.2014)
Published in IEEE transactions on device and materials reliability (01.09.2014)
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Magazine Article
Comparison of Wafer-Level With Package-Level CDM Stress Facilitated by Real-Time Probing
Jack, N., Shukla, V., Rosenbaum, E.
Published in IEEE transactions on device and materials reliability (01.12.2011)
Published in IEEE transactions on device and materials reliability (01.12.2011)
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Magazine Article