Bisphosphonate treatment of type I diabetic mice prevents early bone loss but accentuates suppression of bone formation
Coe, Lindsay M., Tekalur, Srinivasan Arjun, Shu, Yutian, Baumann, Melissa J., McCabe, Laura R.
Published in Journal of cellular physiology (01.08.2015)
Published in Journal of cellular physiology (01.08.2015)
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Journal Article
Improvement of Thermoelectric Properties Via Combination of Nanostructurization and Elemental Doping
Zhao, Ran, Guo, Fu, Shu, Yutian, Zhang, Xin, Lu, Qingmei, Zhang, Jiuxing
Published in JOM (1989) (01.11.2014)
Published in JOM (1989) (01.11.2014)
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Journal Article
Study of silver-copper-palladium solder properties for vacuum electronic devices
Xiaowei Wang, Yutian Shu, Limin Ma, Fu Guo
Published in 2014 15th International Conference on Electronic Packaging Technology (01.05.2014)
Published in 2014 15th International Conference on Electronic Packaging Technology (01.05.2014)
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Conference Proceeding
Failure behaviors of Sn-0.3Ag-0.7Cu solder joint under creep and current stressing
Lei Qiao, Yong Zuo, Limin Ma, Yutian Shu, Fu Guo
Published in 2014 15th International Conference on Electronic Packaging Technology (01.05.2014)
Published in 2014 15th International Conference on Electronic Packaging Technology (01.05.2014)
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Conference Proceeding
Effects of Electromigration on the Creep and Thermal Fatigue Behavior of Sn58Bi Solder Joints
Zuo, Yong, Ma, Limin, Guo, Fu, Qiao, Lei, Shu, Yutian, Lee, Andree, Subramanian, K. N.
Published in Journal of electronic materials (01.12.2014)
Published in Journal of electronic materials (01.12.2014)
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Journal Article
Bisphosphonate treatment of type I diabetic mice prevents early bone loss but accentuates suppression of bone formation: ALENDRONATE RESCUES DIABETIC BONE LOSS
Coe, Lindsay M., Tekalur, Srinivasan Arjun, Shu, Yutian, Baumann, Melissa J., McCabe, Laura R.
Published in Journal of cellular physiology (01.08.2015)
Published in Journal of cellular physiology (01.08.2015)
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Journal Article
Effects of electromigration on the creep of Sn0.3Ag0.7Cu solder joint
Yong Zuo, Limin Ma, Fu Guo, Lei Qiao, Yutian Shu, Jing Han
Published in 2014 15th International Conference on Electronic Packaging Technology (01.05.2014)
Published in 2014 15th International Conference on Electronic Packaging Technology (01.05.2014)
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Conference Proceeding
Slow growth of microcracks in hydroxyapatite during aging
Shu, Yutian, Case, Eldon D., Baumann, Melissa
Published in Journal of materials science (01.09.2012)
Published in Journal of materials science (01.09.2012)
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Journal Article
Effects of Electromigration on the Creep and Thermal Fatigue Behavior of Sn58Bi Solder Joints : Pb-FREE SOLDERS AND MATERIALS FOR EMERGING INTERCONNECT AND PACKAGING TECHNOLOGIES
YONG ZUO, LIMIN MA, FU GUO, LEI QIAO, YUTIAN SHU, LEE, Andree, SUBRAMANIAN, K. N
Published in Journal of electronic materials (2014)
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Published in Journal of electronic materials (2014)
Journal Article
Fracture strength and elastic modulus as a function of porosity for hydroxyapatite and other brittle materials Part I
Fan, Xiaofeng, Case, Eldon D, Ren, Fei, Shu, Yutian, Baumann, Melissa
Published in Journal of the mechanical behavior of biomedical materials (01.01.2012)
Published in Journal of the mechanical behavior of biomedical materials (01.01.2012)
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Journal Article
Fracture strength and elastic modulus as a function of porosity for hydroxyapatite and other brittle materials, Part II
Fan, Xiaofeng, Case, Eldon D, Ren, Fei, Shu, Yutian, Baumann, Melissa
Published in Journal of the mechanical behavior of biomedical materials (01.01.2012)
Published in Journal of the mechanical behavior of biomedical materials (01.01.2012)
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Journal Article
Effects of POSS-Silanol Addition on Whisker Formation in Sn-Based Pb-Free Electronic Solders : LEAD-FREE SOLDERS
SIHAN LIU, LIMIN MA, YUTIAN SHU, SUBRAMANIAN, K. N, LEE, Andre, FU GUO
Published in Journal of electronic materials (2014)
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Published in Journal of electronic materials (2014)
Conference Proceeding