코발트 캡핑된 구리 (COBALT-CAPPED COPPER) 듀얼 다마신 상호 접속부 상의 그래핀 (GRAPHENE) 의 선택적인 증착
RAMANAN VINAYAK, SRINIVASAN EASWAR, SHARMA KASHISH, PARBATANI ASISH, EDELSTEIN DANIEL C, NARKEVICIUTE IEVA, PEETHELA CORNELIUS BROWN, SHOBHA HOSADURGA K, KNARR RANDOLPH, NOGAMI TAKESHI, VARADARAJAN BHADRI N, HUANG HUAI, LI JUNTAO, NGUYEN SON VAN, SCHMITZ STEFAN, VAN SCHRAVENDIJK BART J
Year of Publication 01.04.2024
Get full text
Year of Publication 01.04.2024
Patent
Structural dependence of density in high molecular weight esters
Shobha, Hosadurga K, Kishore, Kaushal
Published in Journal of chemical and engineering data (01.10.1992)
Published in Journal of chemical and engineering data (01.10.1992)
Get full text
Journal Article
Low Hydrogen Silicon Carbon Nitride Cap for High Performance Sub-10 nm Cu-Low k Interconnect
Nguyen, Son van, Shobha, Hosadurga k, Haigh, Thomas J, Yao, Yiping, Tai, Leo, Cohen, Stephan A, Shaw, Thomas M, Hu, Chao-kun, Liniger, Eric, Virwani, Kumar, Kellock, Andrew J, Canaperi, Donald F
Published in ECS transactions (26.04.2017)
Published in ECS transactions (26.04.2017)
Get full text
Journal Article
Ultrathin (8-14 nm) Conformal SiN for sub-20 nm Copper/Low-k Interconnects
Nguyen, Son van, Priyadarshini, Deepika, Shobha, Hosadurga k, Haigh, Thomas J, Hu, Chao-kun, Cohen, Stephan A, Liniger, Eric, Shaw, Thomas M, Adams, Edward D, Burnham, Jay, Madan, Anita, Klymko, Nancy R, Parks, Christopher, Yang, Daewon, Molis, Steven E, Lin, Y, Bonilla, Griselda, Grill, Alfred, Edelstein, Daniel, Canaperi, Donald F, Xia, Li-Qun, Reiter, Steven, Balseanu, Mihaela, Shek, Mei-Yee
Published in ECS transactions (26.03.2014)
Published in ECS transactions (26.03.2014)
Get full text
Journal Article
Copper interconnect structure with manganese barrier layer
Priyadarshini, Deepika, Nguyen, Son V, Edelstein, Daniel C, Shobha, Hosadurga K, Nogami, Takeshi
Year of Publication 25.01.2022
Get full text
Year of Publication 25.01.2022
Patent
Improved Copper Damascene Wires Using Direct Plate on Cobalt Process
Brogan, Lee J, Liu, Yihua, Huie, Matthew M., Reid, Jonathan David, Kelly, James, Shobha, Hosadurga k, Huang, Huai, Motoyama, Koichi, Hu, Chao-kun
Published in Meeting abstracts (Electrochemical Society) (01.05.2019)
Published in Meeting abstracts (Electrochemical Society) (01.05.2019)
Get full text
Journal Article
INTERCONNECT STRUCTURE
Priyadarshini, Deepika, Nguyen, Son V, Edelstein, Daniel C, Shobha, Hosadurga K, Nogami, Takeshi
Year of Publication 24.12.2020
Get full text
Year of Publication 24.12.2020
Patent
Interconnect structure
Priyadarshini, Deepika, Nguyen, Son V, Edelstein, Daniel C, Shobha, Hosadurga K, Nogami, Takeshi
Year of Publication 08.09.2020
Get full text
Year of Publication 08.09.2020
Patent
Initial Transient Phenomena Impact on Plasma CVD of Ultrathin Silicon Nitride and Silicon Carbon Nitride Dielectrics for Nano Devices Cu-Low k Interconnects
Nguyen, Son van, Haigh, Thomas J, Shobha, Hosadurga k, Priyadarshini, Deepika, Canaperi, Donald F
Published in Meeting abstracts (Electrochemical Society) (01.09.2016)
Published in Meeting abstracts (Electrochemical Society) (01.09.2016)
Get full text
Journal Article
Interconnect structure
Priyadarshini, Deepika, Nguyen, Son V, Edelstein, Daniel C, Shobha, Hosadurga K, Nogami, Takeshi
Year of Publication 17.03.2020
Get full text
Year of Publication 17.03.2020
Patent
INTERCONNECT STRUCTURE
NGUYEN, Son V, PRIYADARSHINI, Deepika, EDELSTEIN, Daniel C, NOGAMI, Takeshi, SHOBHA, Hosadurga K
Year of Publication 13.02.2020
Get full text
Year of Publication 13.02.2020
Patent
Copper interconnect structure with manganese oxide barrier layer
Priyadarshini, Deepika, Nguyen, Son V, Edelstein, Daniel C, Shobha, Hosadurga K, Nogami, Takeshi
Year of Publication 18.06.2019
Get full text
Year of Publication 18.06.2019
Patent
Ultrathin multilayer metal alloy liner for nano Cu interconnects
Nguyen, Son, Grill, Alfred, Edelstein, Daniel, Paruchuri, Vamsi K, Yang, Chih-Chao, Shobha, Hosadurga K, Knupp, Seth L, Nogami, Takeshi
Year of Publication 05.05.2020
Get full text
Year of Publication 05.05.2020
Patent
Copper interconnect structure with manganese oxide barrier layer
Priyadarshini, Deepika, Nguyen, Son V, Edelstein, Daniel C, Shobha, Hosadurga K, Nogami, Takeshi
Year of Publication 05.03.2019
Get full text
Year of Publication 05.03.2019
Patent
INTERCONNECT STRUCTURE
NGUYEN, Son V, PRIYADARSHINI, Deepika, EDELSTEIN, Daniel C, NOGAMI, Takeshi, SHOBHA, Hosadurga K
Year of Publication 27.12.2018
Get full text
Year of Publication 27.12.2018
Patent
Low Hydrogen Silicon Carbon Nitride Cap for High Performance Sub-10 nm Cu-Low k Interconnect
Nguyen, Son van, Shobha, Hosadurga k, Haigh, Thomas J, Yao, Yiping, Tai, Leo, Cohen, Stephan A, Shaw, Thomas M, Hu, Chao-kun, Liniger, Eric, Virwani, Kumar, Kellock, Andrew J, Canaperi, Donald F
Published in Meeting abstracts (Electrochemical Society) (15.04.2017)
Published in Meeting abstracts (Electrochemical Society) (15.04.2017)
Get full text
Journal Article
Fully aligned via with integrated air gaps
Clevenger, Lawrence A, Rizzolo, Michael, Penny, Christopher J, Briggs, Benjamin D, Shobha, Hosadurga K, Huang, Huai
Year of Publication 08.05.2018
Get full text
Year of Publication 08.05.2018
Patent
Method of forming a copper based interconnect structure
Priyadarshini, Deepika, Nguyen, Son V, Edelstein, Daniel C, Shobha, Hosadurga K, Nogami, Takeshi
Year of Publication 17.04.2018
Get full text
Year of Publication 17.04.2018
Patent
Copper interconnect structure with manganese oxide barrier layer
Priyadarshini, Deepika, Nguyen, Son V, Edelstein, Daniel C, Shobha, Hosadurga K, Nogami, Takeshi
Year of Publication 17.04.2018
Get full text
Year of Publication 17.04.2018
Patent