Search Results - "Shnawah, Dhafer Abdul-Ameer" :: K.UTB vyhledávací portál | TBU Library Retrieval Portal

Enhancement of thermoelectric properties of Co4Sb12 Skutterudite by Al and La double filling

Enhancement of thermoelectric properties of Co4Sb12 Skutterudite by Al and La double filling

by Bashir, Mohamed Bashir Ali, Mohd Sabri, Mohd Faizul, Said, Suhana Mohd, Miyazaki, Yuzuru, Badruddin, Irfan Anjum, Ameer Shnawah, Dhafer Abdul, Salih, Ethar Yahya, Abushousha, Sabir, Elsheikh, Mohamed Hamid
Published in Journal of solid state chemistry (01.04.2020)

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Journal Article

Microstructure, mechanical, and thermal properties of the Sn–1Ag–0.5Cu solder alloy bearing Fe for electronics applications

Microstructure, mechanical, and thermal properties of the Sn–1Ag–0.5Cu solder alloy bearing Fe for electronics applications

by Shnawah, Dhafer Abdul-Ameer, Said, Suhana Binti Mohd, Sabri, Mohd Faizul Mohd, Badruddin, Irfan Anjum, Che, Fa Xing
Published in Materials science & engineering. A, Structural materials : properties, microstructure and processing (15.08.2012)

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Journal Article

Effect of minor additions of Fe on bulk alloy microstructure and tensile properties of the low Ag-content Sn-1Ag-0.5Cu solder alloy

Effect of minor additions of Fe on bulk alloy microstructure and tensile properties of the low Ag-content Sn-1Ag-0.5Cu solder alloy

by Abdul Ameer Shnawah, Dhafer, Binti Mohd Said, Suhana, Faizul Bin Mohd Sabri, Mohd, Anjum Badruddin, Irfan, Xing Che, Fa
Published in Soldering & surface mount technology (01.01.2012)

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Journal Article

A review on effect of minor alloying elements on thermal cycling and drop impact reliability of low-Ag Sn-Ag-Cu solder joints

A review on effect of minor alloying elements on thermal cycling and drop impact reliability of low-Ag Sn-Ag-Cu solder joints

by Abdul Ameer Shnawah, Dhafer, Faizul Bin Mohd Sabri, Mohd, Anjum Badruddin, Irfan, Said, Suhana
Published in Microelectronics international (01.01.2012)

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Journal Article

Thermoelectric Transport Properties of Double-Filling InxLa0.25Co4Sb12 Skutterudite Materials

Thermoelectric Transport Properties of Double-Filling InxLa0.25Co4Sb12 Skutterudite Materials

by Bashir, Mohamed Bashir Ali, Salih, Ethar Yahya, Said, Suhana Mohd, Miyazaki, Yuzuru, Shnawah, Dhafer Abdul-Ameer, Bashir, M. Nasir, Sajid, Imran Haider, Elsheikh, Mohamed Hamid
Published in Journal of electronic materials (01.02.2023)

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Journal Article

Novel Fe-containing Sn–1Ag–0.5Cu lead-free solder alloy with further enhanced elastic compliance and plastic energy dissipation ability for mobile products

Novel Fe-containing Sn–1Ag–0.5Cu lead-free solder alloy with further enhanced elastic compliance and plastic energy dissipation ability for mobile products

by Shnawah, Dhafer Abdul-Ameer, Said, Suhana Binti Mohd, Sabri, Mohd Faizul Mohd, Badruddin, Irfan Anjum, Che, Fa Xing
Published in Microelectronics and reliability (01.11.2012)

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Journal Article

Microstructure and Tensile Properties of Sn-1Ag-0.5Cu Solder Alloy Bearing Al for Electronics Applications

Microstructure and Tensile Properties of Sn-1Ag-0.5Cu Solder Alloy Bearing Al for Electronics Applications

by Shnawah, Dhafer Abdul-Ameer, Said, Suhana Binti Mohd, Sabri, Mohd Faizul Mohd, Badruddin, Irfan Anjum, Hoe, Teh Guan, Che, Fa Xing, Abood, Adnan Naama
Published in Journal of electronic materials (01.08.2012)

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Journal Article

The bulk alloy microstructure and mechanical properties of Sn–1Ag–0.5Cu–xAl solders (x = 0, 0.1 and 0.2 wt. %)

The bulk alloy microstructure and mechanical properties of Sn–1Ag–0.5Cu–xAl solders (x = 0, 0.1 and 0.2 wt. %)

by Shnawah, Dhafer Abdul-Ameer, Sabri, Mohd Faizul Mohd, Badruddin, Irfan Anjum, Said, Suhana Binti Mohd, Che, Fa Xing
Published in Journal of materials science. Materials in electronics (01.11.2012)

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Journal Article

Oxidation and wetting characteristics of lead-free Sn-0.7Cu solder alloys with the addition of Fe and Bi

Oxidation and wetting characteristics of lead-free Sn-0.7Cu solder alloys with the addition of Fe and Bi

by Jaffery, Syed Hassan Abbas, Sabri, Mohd Faizul Mohd, Rozali, Shaifulazuar, Hasan, Syed Waqar, Mahdavifard, Mohammad Hossein, AL-Zubiady, Dhafer Abdul-ameer Shnawah, Ravuri, Balaji Rao
Published in Microelectronics and reliability (01.12.2022)

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Journal Article

Enhancement of Thermoelectric Behavior of La0.5Co4Sb12−xTex Skutterudite Materials

Enhancement of Thermoelectric Behavior of La0.5Co4Sb12−xTex Skutterudite Materials

by Said, Suhana Mohd, Bashir, Mohamed Bashir Ali, Sabri, Mohd Faizul Mohd, Miyazaki, Yuzuru, Shnawah, Dhafer Abdul Ameer, Hakeem, Abbas Saeed, Shimada, Masanori, Bakare, Akolade Idris, Ghazali, Nik Nazri Nik, Elsheikh, Mohamed Hamid
Published in Metallurgical and materials transactions. A, Physical metallurgy and materials science (01.06.2017)

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Journal Article

Thermoelectric Properties of Microstructurally Modified CoSb^sub 3^ Skutterudite by Hf-Addition

Thermoelectric Properties of Microstructurally Modified CoSb^sub 3^ Skutterudite by Hf-Addition

by Elsheikh, Mohamed Hamid, Sabri, Mohd Faizul; Mohd, Said, Suhana Mohd, Miyazaki, Yuzuru, Masjuki, H H, Shnawah, Dhafer Abdul; Ameer, Long, Bui Duc, Naito, Shuma, Bashir, Mohamed Bashir; Ali
Published in Journal of electronic materials (01.06.2016)

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Journal Article

Thermoelectric Properties of Microstructurally Modified CoSb3 Skutterudite by Hf-Addition

Thermoelectric Properties of Microstructurally Modified CoSb3 Skutterudite by Hf-Addition

by Elsheikh, Mohamed Hamid, Sabri, Mohd Faizul Mohd, Said, Suhana Mohd, Miyazaki, Yuzuru, Masjuki, H. H., Shnawah, Dhafer Abdul Ameer, Long, Bui Duc, Naito, Shuma, Bashir, Mohamed Bashir Ali
Published in Journal of electronic materials (01.06.2016)

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Journal Article

Enhancement of Thermoelectric Behavior of La0.5Co4Sb12−x Te x Skutterudite Materials

Enhancement of Thermoelectric Behavior of La0.5Co4Sb12−x Te x Skutterudite Materials

by Said, Suhana Mohd, Bashir, Mohamed Bashir Ali, Sabri, Mohd Faizul Mohd, Miyazaki, Yuzuru, Shnawah, Dhafer Abdul Ameer, Hakeem, Abbas Saeed, Shimada, Masanori, Bakare, Akolade Idris, Ghazali, Nik Nazri Nik, Elsheikh, Mohamed Hamid
Published in Metallurgical and materials transactions. A, Physical metallurgy and materials science (01.06.2017)

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Journal Article

Enhancement of Thermoelectric Behavior of La^sub 0.5^Co^sub 4^Sb^sub 12-x^Te^sub x^ Skutterudite Materials

Enhancement of Thermoelectric Behavior of La^sub 0.5^Co^sub 4^Sb^sub 12-x^Te^sub x^ Skutterudite Materials

by Said, Suhana Mohd, Bashir, Mohamed Bashir; Ali, Sabri, Mohd Faizul; Mohd, Miyazaki, Yuzuru, Shnawah, Dhafer Abdul; Ameer, Hakeem, Abbas Saeed, Shimada, Masanori, Bakare, Akolade Idris, Ghazali, Nik Nazri; Nik, Elsheikh, Mohamed Hamid
Published in Metallurgical and materials transactions. A, Physical metallurgy and materials science (01.06.2017)

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Journal Article

Enhancement of Thermoelectric Behavior of La sub(0.5)Co sub(4)Sb sub(12-x)Te sub(x) Skutterudite Materials

Enhancement of Thermoelectric Behavior of La sub(0.5)Co sub(4)Sb sub(12-x)Te sub(x) Skutterudite Materials

by Said, Suhana Mohd, Bashir, Mohamed Bashir Ali, Sabri, Mohd Faizul Mohd, Miyazaki, Yuzuru, Shnawah, Dhafer Abdul Ameer, Hakeem, Abbas Saeed, Shimada, Masanori, Bakare, Akolade Idris, Ghazali, Nik Nazri Nik, Elsheikh, Mohamed Hamid
Published in Metallurgical and materials transactions. A, Physical metallurgy and materials science (01.06.2017)

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Journal Article

Microstructural stability and mechanical properties of Sn-1Ag-0.5Cu solder alloy with 0.1 wt.% Al addition under high-temperature annealing

Microstructural stability and mechanical properties of Sn-1Ag-0.5Cu solder alloy with 0.1 wt.% Al addition under high-temperature annealing

by Sabri, M. F. M., Shnawah, D. A-A, Badruddin, I. A., Said, S. B. M.
Published in 2012 35th IEEE/CPMT International Electronics Manufacturing Technology Conference (IEMT) (01.11.2012)

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Conference Proceeding

A compliant lead-free solder alloy

A compliant lead-free solder alloy

by Sabri, M. F. M., Shnawah, D. A., Badruddin, I. A., Said, S. B. M.
Published in 2012 10th IEEE International Conference on Semiconductor Electronics (ICSE) (01.09.2012)

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Conference Proceeding

The bulk alloy microstructure and tensile properties of Sn‐1Ag‐0.5Cu‐ x Al lead‐free solder alloys ( x =0, 1, 1.5 and 2 wt.%)

The bulk alloy microstructure and tensile properties of Sn‐1Ag‐0.5Cu‐ x Al lead‐free solder alloys ( x =0, 1, 1.5 and 2 wt.%)

by Abdul‐Ameer Shnawah, Dhafer, Faizul Mohd Sabri, Mohd, Anjum Badruddin, Irfan, Xing Che, Fa
Published in Microelectronics international (04.05.2012)

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Journal Article

A COMPLIANT AND AGING RESISTANT LEAD-FREE SOLDER ALLOY

A COMPLIANT AND AGING RESISTANT LEAD-FREE SOLDER ALLOY

by MOHD FAIZUL MOHD SABRI, IRFAN, ANJUM BADRUDDIN, SUHANA, BINTI MOHD SAID, DHAFER, ABDUL-AMEER SHNAWAH
Year of Publication 12.09.2013

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Patent