A Mechanistic Thermal Fatigue Model for SnAgCu Solder Joints
Borgesen, Peter, Wentlent, Luke, Hamasha, Sa’d, Khasawneh, Saif, Shirazi, Sam, Schmitz, Debora, Alghoul, Thaer, Greene, Chris, Yin, Liang
Published in Journal of electronic materials (01.05.2018)
Published in Journal of electronic materials (01.05.2018)
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Journal Article
Method of reliably bonding solid metal piece to rigid PCB
Shirazi, Sam Mahin, Burke, Matthew, Wang, Tiexuan, Chiang, Eric T, Yang, Henry H, Li, Yong Gang
Year of Publication 21.05.2024
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Year of Publication 21.05.2024
Patent
Method of Reliably Bonding Solid Metal Piece to Rigid PCB
Shirazi, Sam Mahin, Burke, Matthew, Wang, Tiexuan, Chiang, Eric T, Yang, Henry H, Li, Yong Gang
Year of Publication 16.11.2023
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Year of Publication 16.11.2023
Patent
Reliability and failure mechanism of solder joints in thermal cycling tests
Arfaei, Babak, Mahin-Shirazi, Sam, Joshi, Shantanu, Anselm, Martin, Borgesen, Peter, Cotts, Eric, Wilcox, James, Coyle, Richard
Published in 2013 IEEE 63rd Electronic Components and Technology Conference (01.05.2013)
Published in 2013 IEEE 63rd Electronic Components and Technology Conference (01.05.2013)
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Conference Proceeding