Improved adhesion of plating copper metal on various substrates by controlled interface of Ag nanoparticles and thin polymer layer
Fukazawa, Norimasa, Fujikawa, Wataru, Murakawa, Akira, Shirakami, Jun
Published in 2017 International Conference on Electronics Packaging (ICEP) (01.04.2017)
Published in 2017 International Conference on Electronics Packaging (ICEP) (01.04.2017)
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Conference Proceeding
적층체 및 적층체를 구비한 전자 기기
SHIRAKAMI JUN, FURUTANI AKINORI, HIROTA YOUSUKE, FUJIKAWA WATARU, TAKIZAWA MASAHIRO
Year of Publication 22.03.2024
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Year of Publication 22.03.2024
Patent