Evaluation of outdoor thermal comfort under different building external-wall-surface with different reflective directional properties using CFD analysis and model experiment
Yuan, Jihui, Masuko, Shingo, Shimazaki, Yasuhiro, Yamanaka, Toshio, Kobayashi, Tomohiro
Published in Building and environment (01.01.2022)
Published in Building and environment (01.01.2022)
Get full text
Journal Article
High Degree of Dissociation of Nitrogen Molecules in Large-Volume Electron-Beam-Excited Plasma
Kazunari Taniguchi, Kazunari Taniguchi, Masaya Sugimoto, Masaya Sugimoto, Shingo Masuko, Shingo Masuko, Toshihiro Kobayashi, Toshihiro Kobayashi, Manabu Hamagaki, Manabu Hamagaki, Petros Abraha, Petros Abraha, Tamio Hara, Tamio Hara
Published in Japanese Journal of Applied Physics (01.10.2000)
Published in Japanese Journal of Applied Physics (01.10.2000)
Get full text
Journal Article
Cu Double Side Plating Technology for High Performance and Reliable Si Power Devices
Kobayashi, Hitoshi, Ohguro, Tatsuya, Kai, Tetsuya, Motai, Takako, Ogawa, Masaaki, Matsuo, Mie, Oohashi, Kenichi, Kozumi, Shinsuke, Takada, Yoshiharu, Kojima, Hideharu, Masuko, Shingo, Yonezawa, Naoki, Komatsu, Akira, Nishiwaki, Tatsuya, Hara, Takuma, Takahashi, Mari, Ezaki, Akira, Ohtsuka, Kenichi, Inumiya, Seiji, Suguro, Kyoichi
Published in 2019 31st International Symposium on Power Semiconductor Devices and ICs (ISPSD) (01.05.2019)
Published in 2019 31st International Symposium on Power Semiconductor Devices and ICs (ISPSD) (01.05.2019)
Get full text
Conference Proceeding
Semiconductor device and dicing method
Mizushima, Ichiro, Fujimura, Kazuo, Masuko, Shingo, Takada, Yoshiharu
Year of Publication 22.09.2020
Get full text
Year of Publication 22.09.2020
Patent
SEMICONDUCTOR DEVICE AND DICING METHOD
Mizushima, Ichiro, Fujimura, Kazuo, Masuko, Shingo, Takada, Yoshiharu
Year of Publication 29.08.2019
Get full text
Year of Publication 29.08.2019
Patent