CHIP FOR EVALUATING BOARD, AND BOARD EVALUATING DEVICE
SUGANUMA Katsuaki, SHIMOYAMA Akio, TAKESHITA Kazutaka, WAKASUGI Naoki, KIM Dongjin, NAGAO Shijo
Year of Publication 29.08.2019
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Year of Publication 29.08.2019
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Die Attach for Microelectronic Packaging: Copper Paste Comparison Between Pressure and Pressureless Techniques
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Published in 2023 24th International Conference on Electronic Packaging Technology (ICEPT) (08.08.2023)
Published in 2023 24th International Conference on Electronic Packaging Technology (ICEPT) (08.08.2023)
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Conference Proceeding
SUBSTRATE EVALUATION CHIP AND SUBSTRATE EVALUATION DEVICE
WAKASUGI Naoki, SHIMOYAMA, Akio, NAGAO, Shijo, TAKESHITA, Kazutaka, SUGANUMA, Katsuaki, KIM, Dongjin
Year of Publication 15.05.2024
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Year of Publication 15.05.2024
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SUBSTRATE EVALUATION CHIP AND SUBSTRATE EVALUATION DEVICE
WAKASUGI Naoki, SHIMOYAMA, Akio, NAGAO, Shijo, TAKESHITA, Kazutaka, SUGANUMA, Katsuaki, KIM, Dongjin
Year of Publication 15.05.2024
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Year of Publication 15.05.2024
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Substrate evaluation chip and substrate evaluation device
Nagao, Shijo, Takeshita, Kazutaka, Suganuma, Katsuaki, Kim, Dongjin, Shimoyama, Akio, Wakasugi, Naoki
Year of Publication 27.09.2022
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Year of Publication 27.09.2022
Patent
CHIP FOR EVALUATING BOARD, AND BOARD EVALUATING DEVICE
WAKASUGI Naoki, SHIMOYAMA, Akio, NAGAO, Shijo, TAKESHITA, Kazutaka, SUGANUMA, Katsuaki, KIM, Dongjin
Year of Publication 24.11.2021
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Year of Publication 24.11.2021
Patent
CHIP FOR EVALUATING BOARD, AND BOARD EVALUATING DEVICE
WAKASUGI Naoki, SHIMOYAMA, Akio, NAGAO, Shijo, TAKESHITA, Kazutaka, SUGANUMA, Katsuaki, KIM, Dongjin
Year of Publication 30.12.2020
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Year of Publication 30.12.2020
Patent