Interfacial reaction studies on lead (Pb)-free solder alloys
Kang, S.K., Shih, D.Y., Fogel, K., Lauro, P., Myung-Jin Yim, Advocate, G.G., Griffin, M., Goldsmith, C., Henderson, D.W., Gosselin, T.A., King, D.E., Konrad, J.J., Sarkhel, A., Puttlitz, K.J.
Published in IEEE transactions on electronics packaging manufacturing (01.07.2002)
Published in IEEE transactions on electronics packaging manufacturing (01.07.2002)
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Journal Article
Interfacial reactions, microstructure and mechanical properties of Pb-free solder joints in PBGA laminates
Kang, S.K., Choi, W.K., Shih, D.Y., Lauro, P., Henderson, D.W., Gosselin, T., Leonard, D.N.
Published in 52nd Electronic Components and Technology Conference 2002. (Cat. No.02CH37345) (2002)
Published in 52nd Electronic Components and Technology Conference 2002. (Cat. No.02CH37345) (2002)
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Conference Proceeding
Spalling of intermetallic compounds during the reaction between lead-free solders and electroless Ni-P metallization
Sohn, Y.C., Yu, Jin, Kang, S.K., Shih, D.Y., Lee, T.Y.
Published in Journal of materials research (01.08.2004)
Published in Journal of materials research (01.08.2004)
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Journal Article
Determination of urine melamine by validated isotopic ultra-performance liquid chromatography/tandem mass spectrometry
Cheng, Wei-Chih, Chen, Shu-Kong, Lin, Tien-Jen, Wang, I-Jen, Kao, Ya-Min, Shih, Daniel Yang-Chih
Published in Rapid communications in mass spectrometry (30.06.2009)
Published in Rapid communications in mass spectrometry (30.06.2009)
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Journal Article
Interfacial reaction studies on lead (Pb)-free solder alloys
Kang, S.K., Shih, D.Y., Fogel, K., Lauro, P., Yim, M.J., Advocate, G., Griffin, M., Goldsmith, C., Henderson, D.W., Gosselin, T., King, D., Konrad, J., Sarkhel, A., Puttlitz, K.J.
Published in 2001 Proceedings. 51st Electronic Components and Technology Conference (Cat. No.01CH37220) (2001)
Published in 2001 Proceedings. 51st Electronic Components and Technology Conference (Cat. No.01CH37220) (2001)
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Conference Proceeding
C4NP Cu-cored Pb-free flip chip interconnections
Jae-Woong Nah, Buchwalter, S.L., Gruber, P.A., Shih, D.Y., Furman, B.K.
Published in 2008 58th Electronic Components and Technology Conference (01.05.2008)
Published in 2008 58th Electronic Components and Technology Conference (01.05.2008)
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Conference Proceeding
Injection molded solder technology for Pb-free wafer bumping
Gruber, P.A., Shih, D.Y., Belanger, L., Brouillette, G., Danovitch, D., Oberson, V., Turgeon, M., Kimura, H.
Published in 2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE Cat. No.04CH37546) (2004)
Published in 2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE Cat. No.04CH37546) (2004)
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Conference Proceeding
A new direction for elastomeric connectors
Beaman, B., Shih, D.Y., Walker, G.
Published in Proceedings of IEEE 43rd Electronic Components and Technology Conference (ECTC '93) (1993)
Published in Proceedings of IEEE 43rd Electronic Components and Technology Conference (ECTC '93) (1993)
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Conference Proceeding
Fabrication and performance studies of multilayer polymer/metal interconnect structures for packaging applications
Paraszczak, J., Cataldo, J., Galligan, E., Graham, W., McGouey, R., Nunes, S., Serino, R., Shih, D.Y., Babich, E., Deutsch, A., Kopcsay, G., Goldblatt, R., Hofer, D., Labadie, J., Hedrick, J., Narayan, C., Saenger, K., Shaw, J., Ranieri, V., Ritsko, J., Rothman, L., Volksen, W., Wilczynski, J., Witman, D., Yeh, H.
Published in 1991 Proceedings 41st Electronic Components & Technology Conference (1991)
Published in 1991 Proceedings 41st Electronic Components & Technology Conference (1991)
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Conference Proceeding