Antiangiogenic Effect of Isomalyngamide A Riboside CY01 in Breast Cancer Cells via Inhibition of Migration, Tube Formation and pVEGFR2/pAKT Signals
Shih, Ching-Ying, Chang, Tzu-Ting, Chen, Chia-Ling, Li, Wen-Shan
Published in Anti-cancer agents in medicinal chemistry (01.01.2020)
Published in Anti-cancer agents in medicinal chemistry (01.01.2020)
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Journal Article
Reliability tests for a three dimensional chip stacking structure with through silicon via connections and low cost
Tzu-Ying Kuo, Shu-Ming Chang, Ying-Ching Shih, Chia-Wen Chiang, Chao-Kai Hsu, Ching Kuan Lee, Chun-Te Lin, Yu-Hua Chen, Wei-Chung Lo
Published in 2008 58th Electronic Components and Technology Conference (01.05.2008)
Published in 2008 58th Electronic Components and Technology Conference (01.05.2008)
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Conference Proceeding
Flexible and ultra-thin embedded chip package
Tzu-Ying Kuo, Ying-Ching Shih, Yuan-Chang Lee, Hsiang-Hung Chang, Zhi-Cheng Hsiao, Chia-Wen Chiang, Shu-Man Li, Yu-Jiau Hwang, Cheng-Ta Ko, Yu-Hua Chen
Published in 2009 59th Electronic Components and Technology Conference (01.05.2009)
Published in 2009 59th Electronic Components and Technology Conference (01.05.2009)
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Conference Proceeding
Stacking of ultra-thin film packages
Cheng-Ta Ko, Ying-Ching Shih, Jing-Yao Chang, Tzu-Ying Kuo, Yu-Hua Chen, Ostmann, A., Manessis, D.
Published in 2008 2nd Electronics System-Integration Technology Conference (01.09.2008)
Published in 2008 2nd Electronics System-Integration Technology Conference (01.09.2008)
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Conference Proceeding
An innovative chip-to-wafer and wafer-to-wafer stacking
Wei-Chung Lo, Yu-Hua Chen, Jeng-Dar Ko, Tzu-Ying Kuo, Ying-Ching Shih, Su-Tsai Lu
Published in 56th Electronic Components and Technology Conference 2006 (2006)
Published in 56th Electronic Components and Technology Conference 2006 (2006)
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Conference Proceeding
Manufacturing and stacking of ultra-thin film packages
Ying-Ching Shih, Tzu-Ying Kuo, Yin-Po Hung, Jing-Yao Chang, Chih-Yuan Cheng, Kuo-Chyuan Chen, Ching-Kuan Lee, Chao-Kai Hsu, Jui-Hsiung Huang, Zhi-Cheng Hsiao, Cheng-Ta Ko, Yu-Hua Chen
Published in 2009 59th Electronic Components and Technology Conference (01.05.2009)
Published in 2009 59th Electronic Components and Technology Conference (01.05.2009)
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Conference Proceeding
Stretchable circuit with elastic bumps
Ying-Ching Shih, Cheng-Ta Ko, Yuan-Chang Lee, Yu-Jiau Hwang, Huan-Chun Fu, Kuo-Chyuan Chen, Zhi-Cheng Hsiao, Chih-Yuan Cheng, Yu-Hua Chen
Published in 2008 2nd Electronics System-Integration Technology Conference (01.09.2008)
Published in 2008 2nd Electronics System-Integration Technology Conference (01.09.2008)
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Conference Proceeding
Chip Embedded Wafer Level Packaging Technology for Stacked RF-SiP Application
Chien-Wei Chien, Li-Cheng Shen, Tao-Chih Chang, Chin-Yao Chang, Fang-Jun Leu, Tsung-Fu Yang, Cheng-Ta Ko, Ching-Kuan Lee, Chao-Kai Shu, Yuan-Chang Lee, Ying-Ching Shih
Published in 2007 Proceedings 57th Electronic Components and Technology Conference (01.05.2007)
Published in 2007 Proceedings 57th Electronic Components and Technology Conference (01.05.2007)
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Conference Proceeding
Development and characterization of rigid-flex interface
Su-Tsai Lu, Wei-Chung Lo, Tai-Hong Chen, Yu-Hua Chen, Shu-Ming Chang, Yu-Wei Huang, Yuan-Chang Lee, Tzu-Ying Kuo, Ying-Ching Shih
Published in 56th Electronic Components and Technology Conference 2006 (2006)
Published in 56th Electronic Components and Technology Conference 2006 (2006)
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Conference Proceeding
Wafer level chip stacked module by embedded IC packaging technology
Chien-Wei Chien, Li-Cheng Shen, Tao-Chih Chang, Chin-Yao Chang, Fang-Jun Leu, Tsung-Fu Yang, Cheng-Ta Ko, Ching-Kuan Lee, Chao-Kai Shu, Yuan-Chang Lee, Ying-Ching Shih
Published in 2007 International Microsystems, Packaging, Assembly and Circuits Technology (01.10.2007)
Published in 2007 International Microsystems, Packaging, Assembly and Circuits Technology (01.10.2007)
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Conference Proceeding
Thermal and Electrical Performance Enhancement with a Cost-Effective Packaging for High Speed Memory Chips
Li-Cheng Shen, Chien-Wei Chien, Tao-Chih Chang, Tsung-Fu Yang, Wen-Chih Chen, Yin-Po Hung, Cheng-Ta Ko, Yuan-Chang Lee, Ying-Ching Shih, Wei, I., Lei, C.
Published in 2007 Proceedings 57th Electronic Components and Technology Conference (01.05.2007)
Published in 2007 Proceedings 57th Electronic Components and Technology Conference (01.05.2007)
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Conference Proceeding
Development of Star-Shaped Four-Channel CWDM Optical-Subassembly Module
Ying-Ching Shih, Enboa Wu
Published in Proceedings Electronic Components and Technology, 2005. ECTC '05 (2005)
Published in Proceedings Electronic Components and Technology, 2005. ECTC '05 (2005)
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Conference Proceeding
3D Chip-to-Chip Stacking with Through Silicon Interconnects
Wei-Chung Lo, Shu-Ming Chang, Yu-Hua Chen, Jeng-Dar Ko, Tzu-Ying Kuo, Hsiang-Hung Chang, Ying-Ching Shih
Published in 2007 International Symposium on VLSI Technology, Systems and Applications (VLSI-TSA) (01.04.2007)
Published in 2007 International Symposium on VLSI Technology, Systems and Applications (VLSI-TSA) (01.04.2007)
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Conference Proceeding
Next Standard Packaging Method for DRAM - Chip-in-Substrate Package
Cheng-Ta Ko, Tao-Chih Chang, Chia-Wen Chiang, Tzu-Ying Kuo, Ying-Ching Shih, Yu-Hua Chen
Published in 2006 International Microsystems, Package, Assembly Conference Taiwan (01.10.2006)
Published in 2006 International Microsystems, Package, Assembly Conference Taiwan (01.10.2006)
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Conference Proceeding