High-Performance P-Type Germanium Tri-Gate FETs via Green Nanosecond Laser Crystallization and Counter Doping for Monolithic 3-D ICs
Chung, Hao-Tung, Pan, Yu-Ming, Lin, Nein-Chih, Shih, Bo-Jheng, Yang, Chih-Chao, Shen, Chang-Hong, Cheng, Huang-Chung, Chen, Kuan-Neng
Published in IEEE journal of the Electron Devices Society (2023)
Published in IEEE journal of the Electron Devices Society (2023)
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Journal Article
Single-Crystal Germanium by Elevated-Laser-Liquid-Phase-Epitaxy (ELLPE) Technique for Monolithic 3D ICs
Chung, Hao-Tung, Pan, Yu-Ming, Lin, Nein-Chih, Shih, Bo-Jheng, Yang, Chih-Chao, Shen, Chang-Hong, Huang, Po-Tsang, Cheng, Huang-Chung, Chen, Kuan-Neng, Hu, Chenming
Published in IEEE electron device letters (01.07.2023)
Published in IEEE electron device letters (01.07.2023)
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Journal Article
Advancements in single-crystal silicon with elevated-laser-liquid-phase-epitaxy (ELLPE) for monolithic 3D ICs
Shih, Bo-Jheng, Pan, Yu-Ming, Chung, Hao-Tung, Lin, Nein-Chih, Yang, Chih-Chao, Huang, Po-Tsang, Cheng, Huang-Chung, Shen, Chang-Hong, Shieh, Jia-Min, Wu, Wen-Fa, Chen, Kuan-Neng, Hu, Chenming
Published in Japanese Journal of Applied Physics (01.04.2024)
Published in Japanese Journal of Applied Physics (01.04.2024)
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Journal Article
Ge Single-Crystal-Island (Ge-SCI) Technique and BEOL Ge FinFET Switch Arrays on Top of Si Circuits for Monolithic 3D Voltage Regulators
Chung, Hao-Tung, Shih, Bo-Jheng, Yang, Chih-Chao, Lin, Nei-Chih, Huang, Po-Tsang, Lan, Yun-Ping, Lai, Kuan-Fu, Hsu, Wan-Ting, Pan, Yu-Ming, Hong, Zhong-Jie, Hu, Han-Wen, Cheng, Huang-Chung, Shen, Chang-Hong, Shieh, Jia-Min, Hsueh, Fu-Kuo, Chen, Bo-Yuan, Chang, Da-Chiang, Yeh, Wen-Kuan, Chen, Kuan-Neng, HU, Chenming
Published in 2021 IEEE International Electron Devices Meeting (IEDM) (11.12.2021)
Published in 2021 IEEE International Electron Devices Meeting (IEDM) (11.12.2021)
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Conference Proceeding
Crystal-Orientation-Tolerant Voltage Regulator using Monolithic 3D BEOL FinFETs in Single-Crystal Islands for On-Chip Power Delivery Network
Huang, Po-Tsang, Liu, Yu-Wei, Lai, Kuan-Fu, Lan, Yun-Ping, Tsai, Tzung-Han, Shih, Bo-Jheng, Hsieh, Ping-Yi, Yang, Chih-Chao, Shen, Chang-Hong, Shieh, Jia-Min, Chang, Da-Chiang, Chen, Kuan-Neng, Yeh, Wen-Kuan, Hu, Chenming
Published in 2020 IEEE International Electron Devices Meeting (IEDM) (12.12.2020)
Published in 2020 IEEE International Electron Devices Meeting (IEDM) (12.12.2020)
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Conference Proceeding
3DIC with Stacked FinFET, Inter-Level Metal, and Field-Size ( \mathbf\times \mathbf\mathbf^}) Single-Crystalline Si on SiO2 by Elevated-Epi
Shih, Bo-Jheng, Pan, Yu-Ming, Chung, Hao-Tung, Lee, Chieh-Ling, Hsieh, I-Chun, Lin, Nein-Chih, Yang, Chih-Chao, Huang, Po-Tsang, Chen, Hung-Ming, Wang, Chiao-Yen, Chiu, Huan-Yu, Cheng, Huang-Chung, Shen, Chang-Hong, Wu, Wen-Fa, Hou, Tuo-Hung, Chen, Kuan-Neng, Hu, Chenming
Published in 2024 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits) (16.06.2024)
Published in 2024 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits) (16.06.2024)
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Conference Proceeding
Application of Elevated-Laser-Liquid-Phase-Epitaxy (ELLPE) Technique on Different Oriented Wafers for Monolithic 3DIC Integration
Shih, Bo-Jheng, Pan, Yu-Ming, Wang, Chiao-Yen, Chiu, Huan-Yu, Yang, Chih-Chao, Shen, Chang-Hong, Cheng, Huang-Chung, Chen, Kuan-Neng
Published in 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) (28.05.2024)
Published in 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) (28.05.2024)
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Conference Proceeding
THREE DIMENSIONAL INTEGRATED CIRCUIT AND FABRICATION THEREOF
HUANG, Po-Tsang, SHIH, Bo-Jheng, CHEN, Kuan-Neng, PAN, Yu-Ming, CHUNG, Hao-Tung, HU, Chenming
Year of Publication 21.12.2023
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Year of Publication 21.12.2023
Patent
Integrated circuit structure and fabrication method thereof
HU, CHENMING, SHIH, BO-JHENG, PAN, YU-MING, CHEN, KUAN-NENG, CHUNG, HAO-TUNG, HUANG, PO-TSANG
Year of Publication 01.05.2024
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Year of Publication 01.05.2024
Patent