Epitaxial lift-off process for gallium arsenide substrate reuse and flexible electronics
Cheng, Cheng-Wei, Shiu, Kuen-Ting, Li, Ning, Han, Shu-Jen, Shi, Leathen, Sadana, Devendra K.
Published in Nature communications (12.03.2013)
Published in Nature communications (12.03.2013)
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Journal Article
Three-dimensional integrated circuits
Topol, A. W., Tulipe, D. C. La, Shi, L., Frank, D. J., Bernstein, K., Steen, S. E., Kumar, A., Singco, G. U., Young, A. M., Guarini, K. W., Ieong, M.
Published in IBM journal of research and development (01.07.2006)
Published in IBM journal of research and development (01.07.2006)
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Journal Article
Wafer-level 3D integration technology
Koester, S. J., Young, A. M., Yu, R. R., Purushothaman, S., Chen, K.-N., La Tulipe, D. C., Rana, N., Shi, L., Wordeman, M. R., Sprogis, E. J.
Published in IBM journal of research and development (01.11.2008)
Published in IBM journal of research and development (01.11.2008)
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Journal Article
Hybrid-orientation technology (HOT): opportunities and challenges
Min Yang, Chan, V.W.C., Chan, K.K., Shi, L., Fried, D.M., Stathis, J.H., Chou, A.I., Gusev, E., Ott, J.A., Burns, L.E., Fischetti, M.V., Meikei Ieong
Published in IEEE transactions on electron devices (01.05.2006)
Published in IEEE transactions on electron devices (01.05.2006)
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Journal Article
Extreme scaling with ultra-thin Si channel MOSFETs
Doris, B., Meikei Ieong, Kanarsky, T., Ying Zhang, Roy, R.A., Dokumaci, O., Zhibin Ren, Fen-Fen Jamin, Leathen Shi, Natzle, W., Hsiang-Jen Huang, Mezzapelle, J., Mocuta, A., Womack, S., Gribelyuk, M., Jones, E.C., Miller, R.J., Wong, H.-S.P., Haensch, W.
Published in Digest. International Electron Devices Meeting (2002)
Published in Digest. International Electron Devices Meeting (2002)
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Conference Proceeding
Low-Temperature Oxide Wafer Bonding for 3-D Integration: Chemistry of Bulk Oxide Matters
Wei Lin, Shi, Leathen, Yiping Yao, Madan, Anita, Pinto, Teresa, Zavolas, Nick, Murphy, Richard, Skordas, Spyridon, Iyer, Subramanian
Published in IEEE transactions on semiconductor manufacturing (01.08.2014)
Published in IEEE transactions on semiconductor manufacturing (01.08.2014)
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Journal Article
CD-SEM metrology evaluation of gate-all-around Si nanowire MOSFET with improved control of nanowire suspension by using a buried boron nitride etch-stop layer
Cohen, Guy M., Shi, Leathen, Bangsaruntip, Sarunya, Grill, Alfred, Neumayer, Deborah, Levi, Shimon, Weinberg, Yakov, Shoval, Ori, Adan, Ofer, Tzi, Maayan Bar, Conley, Amiad
Published in 25th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC 2014) (01.05.2014)
Published in 25th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC 2014) (01.05.2014)
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Conference Proceeding
A 23.8-GHz SOI CMOS tuned amplifier
Floyd, B.A., Shi, L., Yuan Taur, Lagnado, I., O, K.K.
Published in IEEE transactions on microwave theory and techniques (01.09.2002)
Published in IEEE transactions on microwave theory and techniques (01.09.2002)
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Journal Article
Epitaxial lift-off process with guided etching
Sadana Devendra K, Shi Leathen, Shiu Kuen-Ting, Cheng Cheng-Wei, Li Ning
Year of Publication 09.01.2018
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Year of Publication 09.01.2018
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