Microstructure and intermetallic growth effects on shear and fatigue strength of solder joints subjected to thermal cycling aging
Pang, H.L.J, Tan, K.H, Shi, X.Q, Wang, Z.P
Published in Materials science & engineering. A, Structural materials : properties, microstructure and processing (15.06.2001)
Published in Materials science & engineering. A, Structural materials : properties, microstructure and processing (15.06.2001)
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Journal Article
Thermally activated transformation of the adsorption configurations of a complex molecule on a Cu(1 1 1) surface
Shi, X.Q., Wang, W.H., Wang, S.Y., Lin, N., Van Hove, M.A.
Published in Catalysis today (22.11.2011)
Published in Catalysis today (22.11.2011)
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Journal Article
Effects of Sb addition on tensile strength of Sn–3.5Ag–0.7Cu solder alloy and joint
Li, G.Y., Chen, B.L., Shi, X.Q., Wong, Stephen C.K., Wang, Z.F.
Published in Thin solid films (10.05.2006)
Published in Thin solid films (10.05.2006)
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Journal Article
Conference Proceeding
Microstructure of eutectic 80Au/20Sn solder joint in laser diode package
Ronnie Teo, J.W., Ng, F.L., Kip Goi, L.S., Sun, Y.F., Wang, Z.F., Shi, X.Q., Wei, J., Li, G.Y.
Published in Microelectronic engineering (01.03.2008)
Published in Microelectronic engineering (01.03.2008)
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Journal Article
Modified Face-Down Bonding of Ridge-Waveguide Lasers Using Hard Solder
Teo, J.W.R., Shi, X.Q., Yuan, S., Li, G.Y., Wang, Z.F.
Published in IEEE transactions on electronics packaging manufacturing (01.04.2008)
Published in IEEE transactions on electronics packaging manufacturing (01.04.2008)
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Journal Article
Optimizing pectin extraction from sunflower heads by alkaline washing
Shi, X.Q., Chang, K.C., Schwarz, J.G., Wiesenborn, D.P., Shih, M.C.
Published in Bioresource technology (01.12.1996)
Published in Bioresource technology (01.12.1996)
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Journal Article
Green emission in ZnO nanostructures—Examination of the roles of oxygen and zinc vacancies
Leung, Y.H., Chen, X.Y., Ng, A.M.C., Guo, M.Y., Liu, F.Z., Djurišić, A.B., Chan, W.K., Shi, X.Q., Van Hove, M.A.
Published in Applied surface science (15.04.2013)
Published in Applied surface science (15.04.2013)
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Journal Article
Interfacial behavior of a flip-chip structure under thermal testing
Zhong, Z.W., Wong, K.W., Shi, X.Q.
Published in IEEE transactions on electronics packaging manufacturing (01.01.2004)
Published in IEEE transactions on electronics packaging manufacturing (01.01.2004)
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Journal Article
Theoretical study on interactions between lignocellulose components and ionic liquids
Wang, J., Zhuang, W. C., Shi, X. Q., Cao, W. L.
Published in IOP conference series. Materials Science and Engineering (01.09.2017)
Published in IOP conference series. Materials Science and Engineering (01.09.2017)
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