Delamination Detection in an Electronic Package by Means of a Newly Developed Delamination Chip Based on Thermal Pixel (Thixel) Array
Kumar, Akhil, Schulz, Marcus, Sheva, Sergey, Keller, Jurgen, Bader, Volker, Wohrmann, Markus, Bauer, Jorg, May, Daniel, Wunderle, Bernhard
Published in 2018 7th Electronic System-Integration Technology Conference (ESTC) (01.09.2018)
Published in 2018 7th Electronic System-Integration Technology Conference (ESTC) (01.09.2018)
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Conference Proceeding
Cost-efficient in-situ end-of-life prognostics of power dies and LEDs by junction temperature measurement
Sheva, Sergey, Mrossko, Raul, Heilmann, Jens, Wunderle, Bernhard, Hantos, Gusztav, Noijen, Sander, Keller, Jurgen
Published in 2016 22nd International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) (01.09.2016)
Published in 2016 22nd International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) (01.09.2016)
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Conference Proceeding
In situ monitoring of interface delamination by the 3ω-method
Schulz, Marcus, Sheva, Sergey, Walter, Hans, Mrobko, Raul, Guanda Yang, Keller, Jurgen, Wunderle, Bernhard
Published in 20th International Workshop on Thermal Investigations of ICs and Systems (01.09.2014)
Published in 20th International Workshop on Thermal Investigations of ICs and Systems (01.09.2014)
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Conference Proceeding