Discharge characteristics of bubbles at the interface between AlN ceramic and FC-72 liquid
Shenyang Mo, Xuebao Li, Zhibin Zhao, Xiang Cui
Published in CSEE Journal of Power and Energy Systems (01.01.2024)
Published in CSEE Journal of Power and Energy Systems (01.01.2024)
Get full text
Journal Article
Surface discharge characteristics and initiation mechanism of PEEK in nitrogen under semi-square voltage
Fu, Pengyu, Zhao, Zhibin, Li, Xuebao, Cui, Xiang, Wen, Teng, Mo, Shenyang
Published in AIP advances (01.07.2018)
Published in AIP advances (01.07.2018)
Get full text
Journal Article
Partial discharge measurement and analysis in PPIs
Fu, Pengyu, Zhao, Zhibin, Li, Xuebao, Cui, Xiang, Wen, Teng, Yang, Zhuodong, Mo, Shenyang, Zhang, Peng
Published in IET power electronics (12.01.2019)
Published in IET power electronics (12.01.2019)
Get full text
Journal Article
Streamer characteristics of PEEK surface in nitrogen driven by positive repetitive pulse voltage
Fu, Pengyu, Zhao, Zhibin, Tang, Xinling, Li, Xuebao, Cui, Xiang, Mo, Shenyang, Wen, Teng, Yang, Zhuodong
Published in IEEE transactions on dielectrics and electrical insulation (01.02.2020)
Published in IEEE transactions on dielectrics and electrical insulation (01.02.2020)
Get full text
Journal Article
Analysis of Discharge Caused by Soldering Defect in Wire-Bonding Power Module
Mo, Shenyang, Chang, Feihao, Yang, Jinlong, Tong, Yan, Luo, Jian, Chen, Yingyi, Fan, Hua
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.12.2022)
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.12.2022)
Get full text
Journal Article
Research on Thermal-Decoupling Method for Chips in Press-Pack IGBT Package
Mo, Shenyang, Tong, Yan, Lyu, Hongshui, Wang, Laili
Published in 2023 2nd Asia Power and Electrical Technology Conference (APET) (28.12.2023)
Published in 2023 2nd Asia Power and Electrical Technology Conference (APET) (28.12.2023)
Get full text
Conference Proceeding
Influence of package parasitic inductance on transient current distribution characteristics of press pack igbt
Mo, Shenyang, Zhao, Zhibin, Sun, Peng, Lu, Ying, Tang, Xinling
Published in 2017 Sixth Asia-Pacific Conference on Antennas and Propagation (APCAP) (01.10.2017)
Published in 2017 Sixth Asia-Pacific Conference on Antennas and Propagation (APCAP) (01.10.2017)
Get full text
Conference Proceeding
Semi-rigid crimping type semiconductor sub-module
MO SHENYANG, LUO JIAN, LIU KEMING, TONG YAN, FANG SHANGHUA, YAN BAIQIANG, ZHANG DAHUA, CHEN ZIMO
Year of Publication 11.06.2024
Get full text
Year of Publication 11.06.2024
Patent