Improvement of Transport Properties in Magnetic Tunneling Junctions by Capping Materials
SHEN, Chih-Ta, YEN, Cheng-Tyng, TSAI, Ming-Jinn, CHEN, Wei-Chuan, YANG, Shan-Yi, WANG, Yung-Hung, LEE, Yuan-Jen, WANG, Ding-Yeong, HUNG, Chien-Chung, SHEN, Kuei-Hung, KAO, Ming-Jer
Published in IEEE transactions on magnetics (01.06.2007)
Published in IEEE transactions on magnetics (01.06.2007)
Get full text
Journal Article
Conference Proceeding
CoWoS Architecture Evolution for Next Generation HPC on 2.5D System in Package
Hu, Yu-Chen, Liang, Yu-Min, Hu, Hsieh-Pin, Tan, Chia-Yen, Shen, Chih-Ta, Lee, Chien-Hsun, Hou, S. Y.
Published in 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) (01.05.2023)
Published in 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) (01.05.2023)
Get full text
Conference Proceeding
Asymmetric Magnetization Reversal in IrMn/CoFe/FeO /CoFe Structures
Hsu, Po-Ching, Lai, Chih-Huang, Huang, Po-Hsiang, Shen, Chih-Ta, Wang, Yung-Hung
Published in IEEE transactions on magnetics (01.10.2006)
Published in IEEE transactions on magnetics (01.10.2006)
Get full text
Journal Article
Co-existence of biquadratic and unidirectional anisotropy in IrMn/CoFe/FeOx/CoFe films
LAI, Chih-Huang, SHEN, Chih-Ta, PO HSIANG HUANG, LIN, H. J, CHEN, C. T
Published in IEEE transactions on magnetics (01.10.2005)
Published in IEEE transactions on magnetics (01.10.2005)
Get full text
Conference Proceeding
Journal Article
GIGA GIGA INTERPOSER INTEGRATION THROUGH CHIP-ON-WAFER-ON-SUBSTRATE
YU CHEN HUA, HOU SHANG YUN, SHIH YING CHING, LU SZU WEI, SHEN CHIH TA, WU CHI HSI, HUANG PING KANG, CHIU SAO LING, WEI WEN HSIN, HU HSIEN PIN, CHIOU WEN CHIH
Year of Publication 01.12.2021
Get full text
Year of Publication 01.12.2021
Patent
Asymmetric magnetization reversal in IrMn/CoFe/FeOX/CoFe structures
HSU, Po-Ching, LAI, Chih-Huang, HUANG, Po-Hsiang, SHEN, Chih-Ta, WANG, Yung-Hung
Published in IEEE transactions on magnetics (01.10.2006)
Published in IEEE transactions on magnetics (01.10.2006)
Get full text
Conference Proceeding
An extensive study for the impacts of structure-wise TSVs on position-oriented MOSFETs with TSV signal disturbance
Pei-Jer Tzeng, Chung-Chih Wang, Li-Hsin Chang, Shang-Chun Chen, Shang-Hung Shen, Chih-Ta Shen, Shih-Hui Wang, Sue-Chen Liao, Cha-Hsin Lin, Dun-Ying Shu, Chwan-Ying Lee, Ming-Jer Kao
Published in Proceedings of 2010 International Symposium on VLSI Technology, System and Application (01.04.2010)
Published in Proceedings of 2010 International Symposium on VLSI Technology, System and Application (01.04.2010)
Get full text
Conference Proceeding
Asymmetric Magnetization Reversal in IrMn/CoFe/FeO rm X/CoFe Structures
Hsu, P.-C., Lai, C.-H., Huang, P.H., Shen, C.-T., Wang, Y.-H.
Published in IEEE transactions on magnetics (01.10.2006)
Published in IEEE transactions on magnetics (01.10.2006)
Get full text
Journal Article
Co-existence of biquadratic and unidirectional anisotropy in IrMn/CoFe/FeO/sub x//CoFe films
Chih-Huang Lai, Chih-Ta Shen, Po Hsiang Huang, Lin, H.J., Chen, C.T.
Published in IEEE transactions on magnetics (01.10.2005)
Published in IEEE transactions on magnetics (01.10.2005)
Get full text
Journal Article
CHIP PACKAGE AND METHODS FOR FORMING THE SAME
Ting, Kuo-Chiang, Hou, Shang-Yun, Huang, Kuan-Yu, Hsu, Chia-Hao, Huang, Sung-Hui, Hsu, Hsien-Pin, Shen, Chih-Ta
Year of Publication 21.03.2024
Get full text
Year of Publication 21.03.2024
Patent
GIGA INTERPOSER INTEGRATION THROUGH CHIP-ON-WAFER-ON-SUBSTRATE
Huang, Ping-Kang, Hou, Shang-Yun, Chiu, Sao-Ling, Yu, Chen-Hua, Lu, Szu-Wei, Wei, Wen-Hsin, Chiou, Wen-Chih, Wu, Chi-Hsi, Shen, Chih-Ta, Hu, Hsien-Pin, Shih, Ying-Ching
Year of Publication 04.07.2024
Get full text
Year of Publication 04.07.2024
Patent
Giga interposer integration through Chip-On-Wafer-On-Substrate
Huang, Ping-Kang, Hou, Shang-Yun, Chiu, Sao-Ling, Yu, Chen-Hua, Lu, Szu-Wei, Wei, Wen-Hsin, Chiou, Wen-Chih, Wu, Chi-Hsi, Shen, Chih-Ta, Hu, Hsien-Pin, Shih, Ying-Ching
Year of Publication 23.04.2024
Get full text
Year of Publication 23.04.2024
Patent
Giga interposer integration through chip-on-wafer-on-substrate
Huang, Ping-Kang, Hou, Shang-Yun, Chiu, Sao-Ling, Yu, Chen-Hua, Lu, Szu-Wei, Wei, Wen-Hsin, Chiou, Wen-Chih, Wu, Chi-Hsi, Shen, Chih-Ta, Hu, Hsien-Pin, Shih, Ying-Ching
Year of Publication 15.08.2023
Get full text
Year of Publication 15.08.2023
Patent
GIGA INTERPOSER INTEGRATION THROUGH CHIP-ON-WAFER-ON-SUBSTRATE
Huang, Ping-Kang, Hou, Shang-Yun, Chiu, Sao-Ling, Yu, Chen-Hua, Lu, Szu-Wei, Wei, Wen-Hsin, Chiou, Wen-Chih, Wu, Chi-Hsi, Shen, Chih-Ta, Hu, Hsien-Pin, Shih, Ying-Ching
Year of Publication 10.11.2022
Get full text
Year of Publication 10.11.2022
Patent
Giga Interposer Integration through Chip-On-Wafer-On-Substrate
Huang, Ping-Kang, Hou, Shang-Yun, Chiu, Sao-Ling, Yu, Chen-Hua, Lu, Szu-Wei, Wei, Wen-Hsin, Chiou, Wen-Chih, Wu, Chi-Hsi, Shen, Chih-Ta, Hu, Hsien-Pin, Shih, Ying-Ching
Year of Publication 25.11.2021
Get full text
Year of Publication 25.11.2021
Patent
Bonded assembly and methods for forming the same
HOU, SHANG-YUN, SHEN, CHIH-TA, HSU, CHIA-HAO, HU, HSIEN-PIN, HUANG, SUNG-HUI, HUANG, KUAN-YU, TING, KUOIANG
Year of Publication 01.04.2024
Get full text
Year of Publication 01.04.2024
Patent
GIGA-INTERPOSER-INTEGRATION DURCH CHIP-ON-WAFER-ON-SUBSTRAT UND VERFAHREN ZUR BILDUNG VON CHIP-ON-WAFER-ON-SUBSTRATE-PAKETEN
Huang, Ping-Kang, Hou, Shang-Yun, Chiu, Sao-Ling, Yu, Chen-Hua, Lu, Szu-Wei, Wei, Wen-Hsin, Chiou, Wen-Chih, Wu, Chi-Hsi, Shen, Chih-Ta, Hu, Hsien-Pin, Shih, Ying-Ching
Year of Publication 14.07.2022
Get full text
Year of Publication 14.07.2022
Patent
Semiconductor structure and mthhod of forming the same
HUANG, PING-KANG, HOU, SHANG-YUN, WU, CHI-HSI, SHEN, CHIH-TA, LU, SZU-WEI, CHIU, SAO-LING, HU, HSIEN-PIN, WEI, WEN-HSIN, CHIOU, WENIH, SHIH, YINGING, YU, CHEN-HUA
Year of Publication 11.07.2022
Get full text
Year of Publication 11.07.2022
Patent
Semiconductor structure and method of forming the same
HUANG, PING-KANG, HOU, SHANG-YUN, WU, CHI-HSI, SHEN, CHIH-TA, LU, SZU-WEI, CHIU, SAO-LING, HU, HSIEN-PIN, WEI, WEN-HSIN, CHIOU, WENIH, SHIH, YINGING, YU, CHEN-HUA
Year of Publication 01.12.2021
Get full text
Year of Publication 01.12.2021
Patent