A numerical and experimental investigation of influential factors for solder joint reliability of power LEDs for automotive applications
Shaygi, Mehrdad, Li, Muyuan, Lang, Kurt-Jurgen, Laux, Harald, Wunderle, Bernhard
Published in 2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) (25.04.2022)
Published in 2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) (25.04.2022)
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