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Ultrathin flexible electrospun EVA nanofiber composite with electrothermally-driven shape memory effect for electromagnetic interference shielding
Wei, Wanting, Zhang, Pengfei, Cao, Feng, Liu, Junhao, Qian, Kun, Pan, Diankun, Yao, Yongtao, Li, Wenbing
Published in Chemical engineering journal (Lausanne, Switzerland : 1996) (15.10.2022)
Published in Chemical engineering journal (Lausanne, Switzerland : 1996) (15.10.2022)
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Sputter deposition of TiNi, TiNiPd and TiPd films displaying the two-way shape-memory effect
Quandt, E, Halene, C, Holleck, H, Feit, K, Kohl, M, Schloβmacher, P, Skokan, A, Skrobanck, K.D
Published in Sensors and actuators. A. Physical. (01.05.1996)
Published in Sensors and actuators. A. Physical. (01.05.1996)
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A study on material removal rate of Cu-Al-Mn shape memory alloys in WEDM
Praveen, N., Mallik, U.S., Shivasiddaramaiah, A.G., Narendra Reddy, G.N.
Published in Materials today : proceedings (2021)
Published in Materials today : proceedings (2021)
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Evaluate of mechanical properties evolution associated with the shape memory effect and superelasticity in Ni-Ti alloy wires
Silva, Daniel De Carvalho, Andrade, Taffael Gongalves, Ribeiro, Shimeni Baptista, Paula, Andersan Dos Santos, Mahesh, Karimbi Koosapa, Fernandes, Francisco Manuel Braz, Otubo, Jorge
Published in Tecnologia em Metalurgia, Materiais e Mineracao (01.01.2011)
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Published in Tecnologia em Metalurgia, Materiais e Mineracao (01.01.2011)
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Sputter deposition of TiNi, TiNiPd and TiPd films displaying the two-way shape-memory effect
Quandt, E, Halene, C, Holleck, H, Feit, K, Kohl, M, Schlossmacher, P, Skokan, A, Skrobanek, K D
Published in Sensors and actuators. A. Physical. (25.06.1995)
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Published in Sensors and actuators. A. Physical. (25.06.1995)
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The Ukraine Defines A New Strategic Direction for Research
Firstov, Sergej G., Orest M. Ivasishin, .
Published in Materials technology (New York, N.Y.) (01.09.2001)
Published in Materials technology (New York, N.Y.) (01.09.2001)
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Shape memory alloy coils optimized for electrical connectors
Yurick, T.J., Mohney, S.E., Gray, G.L.
Published in IEEE transactions on components and packaging technologies (01.09.2001)
Published in IEEE transactions on components and packaging technologies (01.09.2001)
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