Using state-space models for accurate computations of transient thermal behavior of electronic packages
Shankaran, Gokul V., Dogruoz, M. Baris, Magargle, Ryan
Published in Fourteenth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) (01.05.2014)
Published in Fourteenth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) (01.05.2014)
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Conference Proceeding
Orthotropic thermal conductivity and Joule heating effects on the temperature distribution of printed circuit boards
Shankaran, Gokul V., Dogruoz, M. Baris, de Araujo, Daniel
Published in 2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (01.06.2010)
Published in 2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (01.06.2010)
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Conference Proceeding
Development of RC network compact models of IC packages using multigrid method
Nagulapally, M., Shankaran, G.V., Zhao, S.Z.
Published in The Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena In Electronic Systems (IEEE Cat. No.04CH37543) (2004)
Published in The Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena In Electronic Systems (IEEE Cat. No.04CH37543) (2004)
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Conference Proceeding