Remarkable strength of CoCrFeNi high-entropy alloy wires at cryogenic and elevated temperatures
Huo, Wenyi, Fang, Feng, Zhou, Hui, Xie, Zonghan, Shang, Jianku, Jiang, Jianqing
Published in Scripta materialia (01.12.2017)
Published in Scripta materialia (01.12.2017)
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Journal Article
Hydrous cerium oxides coated glass fiber for efficient and long-lasting arsenic removal from drinking water
Li, Ronghui, Yang, Weiyi, Gao, Shuang, Shang, Jianku, Li, Qi
Published in Journal of advanced ceramics (01.04.2021)
Published in Journal of advanced ceramics (01.04.2021)
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Journal Article
Thermal Performance of Low-Melting-Temperature Alloy Thermal Interface Materials
Yang, E., Guo, Hongyan, Guo, Jingdong, Shang, Jianku, Wang, Mingguang
Published in Acta metallurgica sinica : English letters (01.04.2014)
Published in Acta metallurgica sinica : English letters (01.04.2014)
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Journal Article
Application of Electroless Fe−42Ni(P) Film for Under-bump Metallization on Solder Joint
Zhou, Haifei, Guo, Jingdong, Zhu, Qingsheng, Shang, Jianku
Published in Journal of materials science & technology (01.01.2013)
Published in Journal of materials science & technology (01.01.2013)
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Journal Article
Electronic band structures of TiO2 with heavy nitrogen doping
Xue, Jinbo, Li, Qi, Liang, Wei, Shang, Jianku
Published in Journal of Wuhan University of Technology. Materials science edition (01.12.2008)
Published in Journal of Wuhan University of Technology. Materials science edition (01.12.2008)
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Journal Article
Highly solderability of FeP film in contact with SnAgCu solder
Zhou, Haifei, Guo, Jingdong, Shang, Jianku, Song, Xiaoning
Published in Journal of alloys and compounds (25.03.2020)
Published in Journal of alloys and compounds (25.03.2020)
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Journal Article
Characteristics investigation of Ni-diamond composite electrodeposition
Zhou, Haifei, Du, Nan, Zhu, Liwei, Shang, Jianku, Qian, Zhouhai, Shen, Xiaoming
Published in Electrochimica acta (01.01.2015)
Published in Electrochimica acta (01.01.2015)
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Journal Article
Electroless Deposition of Highly Solderable Fe-Ni Films
Zhou, Haifei, Guo, Jingdong, Shang, Jianku
Published in Journal of the Electrochemical Society (01.01.2013)
Published in Journal of the Electrochemical Society (01.01.2013)
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Journal Article
Prediction model of lifetime for copper pillar bumps under coupling effects of current and thermal cycling
Ma, Huicai, Guo, Jingdong, Chen, Jianqiang, Wu, Di, Liu, Zhiquan, Zhu, Qingsheng, Shang, Jianku, Zhang, Li, Guo, Hongyan
Published in Journal of materials science. Materials in electronics (01.02.2016)
Published in Journal of materials science. Materials in electronics (01.02.2016)
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Journal Article
Synthesis and Characterization of Niobium-doped TiO2 Nanotube Arrays by Anodization of Ti-20Nb Alloys
Xu, Zhengchao, Li, Qi, Gao, Shian, Shang, Jianku
Published in Journal of materials science & technology (01.10.2012)
Published in Journal of materials science & technology (01.10.2012)
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Journal Article
Enhanced stress relaxation of Sn–3.8Ag–0.7Cu solder by electrical current
Liu, Haiyan, Zhu, Qingsheng, Zhang, Li, Wang, Zhongguang, Shang, Jian Ku
Published in Journal of materials research (01.06.2010)
Published in Journal of materials research (01.06.2010)
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Journal Article
Synthesis and Characterization of Niobium-doped TiO(2) Nanotube Arrays by Anodization of Ti-20Nb Alloys
Xu, Zhengchao, Li, Qi, Gao, Shian, Shang, Jianku
Published in Journal of materials science & technology (01.10.2012)
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Published in Journal of materials science & technology (01.10.2012)
Journal Article
A New Approach for the Evaluation of Interfacial Reliability in Micro-scale
Qingsheng Zhu, Zhefeng Zhang, Jianku Shang, Zhongguang Wang
Published in 2007 8th International Conference on Electronic Packaging Technology (01.08.2007)
Published in 2007 8th International Conference on Electronic Packaging Technology (01.08.2007)
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Conference Proceeding