Effects of temperature on mechanical properties of SU-8 photoresist material
Chung, Soonwan, Park, Seungbae
Published in Journal of mechanical science and technology (01.09.2013)
Published in Journal of mechanical science and technology (01.09.2013)
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Journal Article
High-cycle fatigue life prediction for Pb-free BGA under random vibration loading
Yu, Da, Al-Yafawi, Abdullah, Nguyen, Tung T., Park, Seungbae, Chung, Soonwan
Published in Microelectronics and reliability (01.03.2011)
Published in Microelectronics and reliability (01.03.2011)
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Journal Article
A Study on the Thermomechanical Reliability Risks of Through-Silicon-Vias in Sensor Applications
Shao, Shuai, Liu, Dapeng, Niu, Yuling, O'Donnell, Kathy, Sengupta, Dipak, Park, Seungbae
Published in Sensors (Basel, Switzerland) (09.02.2017)
Published in Sensors (Basel, Switzerland) (09.02.2017)
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Journal Article
Measurement of deformations in SnAgCu solder interconnects under in situ thermal loading
Park, Seungbae, Dhakal, Ramji, Lehman, Lawrence, Cotts, Eric
Published in Acta materialia (01.05.2007)
Published in Acta materialia (01.05.2007)
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Journal Article
Investigation of Stress in MEMS Sensor Device Due to Hygroscopic and Viscoelastic Behavior of Molding Compound
Yeonsung Kim, Dapeng Liu, Hohyung Lee, Ruiyang Liu, Sengupta, Dipak, Seungbae Park
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.07.2015)
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.07.2015)
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Journal Article