Pd effects on the reliability in the low cost Ag bonding wire
Jong-Soo Cho, Kyeong-Ah Yoo, Sung-Jae Hong, Jeong-Tak Moon, Yong-Je Lee, Wongil Han, Hanki Park, Seung-Weon Ha, Seong-Bum Son, Suk-Hoon Kang, Kyu-Hwan Oh
Published in 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC) (01.06.2010)
Published in 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC) (01.06.2010)
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Conference Proceeding
Thermal reliability & IMC behavior of low cost alternative Au-Ag-Pd wire bonds to Al metallization
Jong-Soo Cho, Hee-Suk Jeong, Jeong-Tak Moon, Se-Jin Yoo, Jae-Seok Seo, Seung-Mi Lee, Seung-Weon Ha, Eun-Kyu Her, Suk-Hoon Kang, Kyu-Hwan Oh
Published in 2009 59th Electronic Components and Technology Conference (01.05.2009)
Published in 2009 59th Electronic Components and Technology Conference (01.05.2009)
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Conference Proceeding
Method of manufacturing multi-chip package
Han, Won-Gil, Ha, Seung-Weon, Lee, Jae-Heung, Kim, Byong-Joo, Lee, Yong-Je
Year of Publication 09.06.2020
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Year of Publication 09.06.2020
Patent
Multi-chip package and method of manufacturing the same
Han, Won-Gil, Ha, Seung-Weon, Lee, Jae-Heung, Kim, Byong-Joo, Lee, Yong-Je
Year of Publication 04.12.2018
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Year of Publication 04.12.2018
Patent
Surface inspection apparatus for semiconductor chips
Mun Youn-Jo, Kim Sang-Young, An Yun-Kyu, Cho Sung-Il, Yang Jin-Yeol, Hwang Soon-Kyu, Sohn Hoon, Ha Seung-Weon
Year of Publication 22.11.2016
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Year of Publication 22.11.2016
Patent
MULTI-CHIP PACKAGE
SEUNG-WEON HA, BYONG-JOO KIM, YONG-JE LEE, JAE-HEUNG LEE, WON-GIL HAN
Year of Publication 01.05.2018
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Year of Publication 01.05.2018
Patent
METHOD OF MANUFACTURING MULTI-CHIP PACKAGE
HA, Seung-Weon, LEE, Yong-Je, KIM, Byong-Joo, HAN, Won-Gil, LEE, Jae-Heung
Year of Publication 04.04.2019
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Year of Publication 04.04.2019
Patent
MULTI-CHIP PACKAGE AND METHOD OF MANUFACTURING THE SAME
HA, Seung-Weon, LEE, Yong-Je, KIM, Byong-Joo, HAN, Won-Gil, LEE, Jae-Heung
Year of Publication 26.04.2018
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Year of Publication 26.04.2018
Patent
SURFACE INSPECTION APPARATUS FOR SEMICONDUCTOR CHIPS
MUN YOUN-JO, HWANG SOON-KYU, KIM SANG-YOUNG, AN YUN-KYU, YANG JIN-YEOL, CHO SUNG-IL, SOHN HOON, HA SEUNG-WEON
Year of Publication 23.07.2015
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Year of Publication 23.07.2015
Patent
PRINTED CIRCUIT BOARD FOR FLIP CHIP BONDING AND BALL GRID ARRAY PACKAGE MANUFACTURING METHOD USING THE SAME
HA, SEUNG WEON, KWAK, YONG IL, JUNG, YONG JIN, HAN, JUN SOO, KIM, GIL BEAG
Year of Publication 08.08.2007
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Year of Publication 08.08.2007
Patent
CHIP SCALE PACKAGE
HA, SEUNG WEON, KWAK, YONG IL, JUNG, YONG JIN, HAN, JUN SOO, KIM, GIL BEAG
Year of Publication 10.05.2007
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Year of Publication 10.05.2007
Patent