Development of Package-on-Package Using Embedded Wafer-Level Package Approach
Ser Choongv Chong, Wee, David Ho Soon, Rao, Vempati Srinivasa, Vasarla, Nagendra Sekhar
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.10.2013)
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.10.2013)
Get full text
Journal Article