Studies on the Thermal Cycling Reliability of BGA System-in-Package (SiP) With an Embedded Die
YOUNG YU, Seon, KWON, Yong-Min, KIM, Jinsu, JEONG, Taesung, CHOI, Seogmoon, PAIK, Kyung-Wook
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.04.2012)
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.04.2012)
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Journal Article
Issues in junction-to-case thermal characterization of power packages with large surface area
Vass-Varnai, Andras, Shan Gao, Sarkany, Zoltan, Jongman Kim, Seogmoon Choi, Farkas, Gabor, Poppe, Andras, Rencz, Marta
Published in 2010 26th Annual IEEE Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM) (01.02.2010)
Published in 2010 26th Annual IEEE Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM) (01.02.2010)
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Conference Proceeding
Design optimization on the heat transfer and mechanical reliability of High Brightness Light Emitting Diodes (HBLED) package
Shan Gao, Jupyo Hong, Sanghyun Shin, Yongki Lee, Seogmoon Choi, Sung Yi
Published in 2008 58th Electronic Components and Technology Conference (01.05.2008)
Published in 2008 58th Electronic Components and Technology Conference (01.05.2008)
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Conference Proceeding
Effects of Packaging Materials on the Reliability of System in Package
Shan Gao, Jupyo Hong, Jinsu Kim, Seogmoon Choi, Sung Yi
Published in 2007 8th International Conference on Electronic Packaging Technology (01.08.2007)
Published in 2007 8th International Conference on Electronic Packaging Technology (01.08.2007)
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Conference Proceeding
Study on the thermal cycle and drop test reliability of system-in-packages with an Embedded die
Seon Young Yu, Yong-Min Kwon, Jinsu Kim, Taesung Jeong, Seogmoon Choi, Kyung-Wook Paik
Published in 2011 IEEE 61st Electronic Components and Technology Conference (ECTC) (01.05.2011)
Published in 2011 IEEE 61st Electronic Components and Technology Conference (ECTC) (01.05.2011)
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Conference Proceeding
Warpage control of wireless LAN SiP during manufacturing process
Shan Gao, Jupyo Hong, Jungho Hyun, Seogmoon Choi, Sung Yi
Published in 2007 International Conference on Electronic Materials and Packaging (01.11.2007)
Published in 2007 International Conference on Electronic Materials and Packaging (01.11.2007)
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Conference Proceeding
Study of a Wafer Level Package (WLP) for Surface Acoustic Wave (SAW) Filter
Shan Gao, Jupyo Hong, Taehoon Kim, Seogmoon Choi, Sung Yi
Published in 2006 International Conference on Electronic Materials and Packaging (01.12.2006)
Published in 2006 International Conference on Electronic Materials and Packaging (01.12.2006)
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Conference Proceeding
Parametric design study for minimized warpage of WL-CSP
Jupyo Hong, Shan Gao, Seoungwook Park, SeonHee Moon, Jonghwan Baek, Seogmoon Choi, Sung Yi
Published in 2008 2nd Electronics System-Integration Technology Conference (01.09.2008)
Published in 2008 2nd Electronics System-Integration Technology Conference (01.09.2008)
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Conference Proceeding
"CCTO thin film growth on a Cu plated Si wafer by pulse laser deposition at low temperatures"
Lee, Joseph Y, JungWon Lee, Yul-Kyu Chung, SeogMoon Choi, Jongin Ryu, BumSik Jang
Published in 2008 33rd IEEE/CPMT International Electronics Manufacturing Technology Conference (IEMT) (01.11.2008)
Published in 2008 33rd IEEE/CPMT International Electronics Manufacturing Technology Conference (IEMT) (01.11.2008)
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Conference Proceeding