Resolving Multi‐Stage Rupture Process of the 2021 Mw 4.9 Offshore Jeju Island Earthquake From Relative Source Time Functions
Han, Sangwoo, Kim, Won‐Young, Lim, Hobin, Son, Young Oh, Seo, Min‐Seong, Park, Jun Yong, Kim, YoungHee
Published in Geophysical research letters (16.02.2024)
Published in Geophysical research letters (16.02.2024)
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Journal Article
Measurement of seismometer misorientation based on P-wave polarization: application to dense temporary broadband seismic array in the epicentral region of 2016 Gyeongju earthquake, South Korea
Seo, Min-Seong, Son, Young Oh, Kim, YoungHee, Kang, Tae-Seob, Rhie, Junkee, Kim, Kwang-Hee, Ree, Jin-Han
Published in Geosciences journal (Seoul, Korea) (01.06.2022)
Published in Geosciences journal (Seoul, Korea) (01.06.2022)
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Journal Article
The 14 December 2021 Mw 4.9 Offshore Jeju Island, Korea, Earthquake: Seismological Observation of an Intraplate Earthquake Provides Insight into Regional Seismotectonics
Kim, Won-Young, Park, Jun Yong, Seo, Min-Seong, Son, Young Oh, Lim, Hobin, Han, Sangwoo, Kim, YoungHee
Published in The Seismic record (01.04.2022)
Published in The Seismic record (01.04.2022)
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Journal Article
Deployment of the linear array with geophones on the fault zone of the 2016 Mw 5.5 Gyeongju earthquake
Lim, Hobin, Kim, YoungHee, Kwon, Ki Baek, Han, Jaeseoung, Ahn, Byeong Seok, Chai, Gyeongdon, Choi, Yeongjae, Heo, Dabeen, Jung, Yunsun, Kang, Hyunsun, Koh, Min Hyug, Kwon, Joa, Park, Jun Yong, Seo, Min-Seong, Son, Young Oh, Han, Sangwoo, Kang, Tae-Seob, Rhie, Junkee, Kim, Kwang-Hee, Ree, Jin-Han
Published in Journal of the Geological Society of Korea (01.10.2021)
Published in Journal of the Geological Society of Korea (01.10.2021)
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Journal Article
Rupture Model of the 5 April 2024 Tewksbury, New Jersey, Earthquake Based on Regional Lg -Wave Data
Han, Sangwoo, Kim, Won-Young, Park, Jun Yong, Seo, Min-Seong, Kim, YoungHee
Published in The Seismic record (01.09.2024)
Published in The Seismic record (01.09.2024)
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Journal Article
A Review on the Fabrication and Reliability of Three-Dimensional Integration Technologies for Microelectronic Packaging: Through-Si-via and Solder Bumping Process
Cho, Do Hoon, Seo, Seong Min, Kim, Jang Baeg, Rajendran, Sri Harini, Jung, Jae Pil
Published in Metals (Basel ) (01.10.2021)
Published in Metals (Basel ) (01.10.2021)
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