Copper oxide atomic layer deposition on thermally pretreated multi-walled carbon nanotubes for interconnect applications
Melzer, Marcel, Waechtler, Thomas, Müller, Steve, Fiedler, Holger, Hermann, Sascha, Rodriguez, Raul D., Villabona, Alexander, Sendzik, Andrea, Mothes, Robert, Schulz, Stefan E., Zahn, Dietrich R.T., Hietschold, Michael, Lang, Heinrich, Gessner, Thomas
Published in Microelectronic engineering (01.07.2013)
Published in Microelectronic engineering (01.07.2013)
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