by Gerges, Tony, Semet, Vincent, Lombard, Philippe, Gaillard, Sophie, Cabrera, Michel, Lambert, Simon Auguste
Published in Frontiers in physics (28.07.2020)

by Gnanago, Jean-Lynce, Capsal, Jean-Fabien, Gerges, Tony, Lombard, Philippe, Semet, Vincent, Cottinet, Pierre-Jean, Cabrera, Michel, Lambert, Simon Auguste
Published in Frontiers in physics (30.09.2021)

by Gerges, Tony, Semet, Vincent, Lombard, Philippe, Allard, Bruno, Cabrera, Michel
Published in Additive manufacturing (05.07.2023)

by DEMAN, A.-L, BRUN, M, QUATRESOUS, M, CHATEAUX, J.-F, FRENEA-ROBIN, M, HADDOUR, N, SEMET, V, FERRIGNO, R
Published in Journal of micromechanics and microengineering (01.09.2011)

by Ait-Ali, Imène, Morin, Pierre, Semet, Vincent, Cabrera, Michel, Ferrigno, Rosaria
Published in Procedia engineering (2012)

by Lombard, Ph, Cabrera, M, Semet, V, Allard, B, Kamotesov, S, Moguedet, Maël, J-Y Charmeau
Published in Journal sur l'enseignement des sciences et technologies de l'information et des systèmes (01.01.2017)

by Sergkei, Kamotesov, Lombard, Philippe, Semet, Vincent, Allard, Bruno, Moguedet, Mael, Cabrera, Michel
Published in 2018 13th International Congress Molded Interconnect Devices (MID) (01.09.2018)

by GERGES, Tony, SEMET, Vincent, GNANAGO, Jean-lynce, LOMBARD, Philippe, LAMBERT, Simon, CABRERA, Michel
Year of Publication 23.10.2024

by GERGES, Tony, SEMET, Vincent, GNANAGO, Jean-lynce, LOMBARD, Philippe, LAMBERT, Simon, CABRERA, Michel
Year of Publication 13.06.2024

by Kamotesov, Sergkei, Lombard, Philippe, Semet, Vincent, Allard, Bruno, Moguedet, Mael, Cabrera, Michel
Published in 2018 IEEE Wireless Power Transfer Conference (WPTC) (01.06.2018)

by Sergkei, Kamotesov, Lombard, Philippe, Semet, Vincent, Allard, Bruno, Moguedet, Mael, Cabrera, Michel
Published in 2019 IEEE Wireless Power Transfer Conference (WPTC) (01.06.2019)

by Kamotesov, Sergkei, Lombard, Philippe, Vollaire, Christian, Semet, Vincent, Cabrera, Michel, Dahmani, Rabah, Veille, Amaury, Moguedet, Maël
Published in 2016 12th International Congress Molded Interconnect Devices (MID) (01.09.2016)

by SEMET VINCENT
Year of Publication 28.03.2014

by Thevenard, Paul A., Dupin, Jean-Pierre, Vu Thien, Binh, Purcell, Stephen T., Semet, Vincent
Published in Surface & coatings technology (01.06.2000)

by GERGES, Tony, SEMET, Vincent, LOMBARD, Philippe, LAMBERT, Simon, CABRERA, Michel, GNANAGO, Jean-Lynce
Year of Publication 08.03.2024

by SEMET VINCENT
Year of Publication 02.08.2013

by SEMET, VINCENT
Year of Publication 01.08.2013

by GERGES, Tony, SEMET, Vincent, GNANAGO, Jean-lynce, LOMBARD, Philippe, LAMBERT, Simon, CABRERA, Michel
Year of Publication 22.06.2023

by GERGES, Tony, SEMET, Vincent, LOMBARD, Philippe, LAMBERT, Simon, CABRERA, Michel, GNANAGO, Jean-Lynce
Year of Publication 16.06.2023

by Vu Thien Binh, Mouton, R, Adessi, C, Semet, V, Cahay, M, Fairchild, S
Published in International Vacuum Nanoelectronics Conference (01.07.2010)