Stress–Strain Characteristics of Tin-Based Solder Alloys for Drop-Impact Modeling
Wong, E.H., Selvanayagam, C.S., Seah, S.K.W., van Driel, W.D., Caers, J.F.J.M., Zhao, X.J., Owens, N., Tan, L.C., Frear, D.R., Leoni, M., Lai, Y.-S., Yeh, C.-L.
Published in Journal of electronic materials (01.06.2008)
Published in Journal of electronic materials (01.06.2008)
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Journal Article
Stress–strain characteristics of tin-based solder alloys at medium strain rate
Wong, E.H., Selvanayagam, C.S., Seah, S.K.W., van Driel, W.D., Caers, J.F.J.M., Zhao, X.J., Owens, N., Tan, L.C., Frear, D.R., Leoni, M., Lai, Y.-S., Yeh, C.-L.
Published in Materials letters (30.06.2008)
Published in Materials letters (30.06.2008)
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Journal Article
High-Speed Cyclic Bend Tests and Board-Level Drop Tests for Evaluating the Robustness of Solder Joints in Printed Circuit Board Assemblies
Wong, E.H., Seah, S.K.W., Selvanayagam, C.S., Rajoo, R., van Driel, W.D., Caers, J.F.J.M., Zhao, X.J., Owens, N., Leoni, M., Tan, L.C., Lai, Y.-S., Yeh, C.-L.
Published in Journal of electronic materials (01.06.2009)
Published in Journal of electronic materials (01.06.2009)
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Journal Article
Correlation studies for component level ball impact shear test and board level drop test
Wong, E.H., Rajoo, R., Seah, S.K.W., Selvanayagam, C.S., van Driel, W.D., Caers, J.F.J.M., Zhao, X.J., Owens, N., Tan, L.C., Leoni, M., Eu, P.L., Lai, Y.-S., Yeh, C.-L.
Published in Microelectronics and reliability (01.07.2008)
Published in Microelectronics and reliability (01.07.2008)
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Journal Article
A Study of Crack Propagation in Pb-Free Solder Joints
Caers, J.F.J.M., Zhao, X.J., Wong, E.H., Seah, S.K.W., Selvanayagam, C.S., van Driel, W.D., Owens, N., Leoni, M., Tan, L.C., Eu, P.L., Yi-Shao Lai, Chang-Lin Yeh
Published in IEEE transactions on electronics packaging manufacturing (01.04.2010)
Published in IEEE transactions on electronics packaging manufacturing (01.04.2010)
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Journal Article
Latent expression of p53 mutations and radiation-induced mammary cancer
SELVANAYAGAM, C. S, DAVIS, C. M, CORNFORTH, M. N, ULLRICH, R. L
Published in Cancer research (Chicago, Ill.) (01.08.1995)
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Published in Cancer research (Chicago, Ill.) (01.08.1995)
Journal Article
Constitutive modeling of solder alloys for drop-impact applications
Wong, E.H., Chrisp, J., Selvanayagam, C.S., Seah, S.K.W.
Published in Microelectronics and reliability (01.12.2016)
Published in Microelectronics and reliability (01.12.2016)
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Journal Article
Transcriptional regulation of a hematopoietic proteoglycan core protein gene during hematopoiesis
Stellrecht, C M, Fraizer, G, Selvanayagam, C, Chao, L Y, Lee, A, Saunders, G F
Published in The Journal of biological chemistry (25.02.1993)
Published in The Journal of biological chemistry (25.02.1993)
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Journal Article
A low stress bond pad design for low temperature solder interconnections on through silicon vias (TSVs)
Xiaowu Zhang, Rajoo, R, Selvanayagam, C S, Premachandran, C S, Choi, W K, Ho, S W, Ong, S W, Ling Xie, Pinjala, D, Sekhar, V N, Kwong, D.-L
Published in 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC) (01.06.2010)
Published in 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC) (01.06.2010)
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Conference Proceeding
Multiple origins of transcription for the human placental lactogen genes
Selvanayagam, C S, Tsai, S Y, Tsai, M J, Selvanayagam, P, Saunders, G F
Published in The Journal of biological chemistry (10.12.1984)
Published in The Journal of biological chemistry (10.12.1984)
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Journal Article
Development of Large Die Fine-Pitch Cu/Low- k FCBGA Package With Through Silicon via (TSV) Interposer
Tai Chong Chai, Xiaowu Zhang, Lau, J H, Selvanayagam, C S, Damaruganath, P, Hoe, Y Y G, Yue Ying Ong, Rao, V S, Wai, E, Hong Yu Li, Liao, E B, Ranganathan, N, Vaidyanathan, K, Shiguo Liu, Jiangyan Sun, Ravi, M, Vath, C J, Tsutsumi, Y
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.05.2011)
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.05.2011)
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Journal Article
Application of Piezoresistive Stress Sensor in Wafer Bumping and Drop Impact Test of Embedded Ultrathin Device
Xiaowu Zhang, Rajoo, R., Selvanayagam, C. S., Kumar, A., Rao, V. S., Khan, N., Kripesh, V., Lau, J. H., Dim-Lee Kwong, Sundaram, V., Tummala, R. R.
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.06.2012)
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.06.2012)
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Journal Article
Low-Stress Bond Pad Design for Low-Temperature Solder Interconnections on Through-Silicon Vias (TSVs)
Xiaowu Zhang, Rajoo, R, Selvanayagam, C S, Premachandran, C S, Won Kyoung Choi, Soon Wee Ho, Siong Chiew Ong, Ling Xie, Pinjala, D, Dim-Lee Kwong, Yee Mong Khoo, Shan Gao
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.04.2011)
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.04.2011)
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Journal Article
Development of through silicon via (TSV) interposer technology for large die (21×21mm) fine-pitch Cu/low-k FCBGA package
Zhang, X., Chai, T.C., Lau, J.H., Selvanayagam, C.S., Biswas, K., Shiguo Liu, Pinjala, D., Tang, G.Y., Ong, Y.Y., Vempati, S.R., Wai, E., Li, H.Y., Liao, E.B., Ranganathan, N., Kripesh, V., Jiangyan Sun, Doricko, J., Vath, C.J.
Published in 2009 59th Electronic Components and Technology Conference (01.05.2009)
Published in 2009 59th Electronic Components and Technology Conference (01.05.2009)
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Conference Proceeding
Simulation approach to improving BGA reliability on coreless packages
Selvanayagam, C., Mandal, R.
Published in 2012 IEEE 14th Electronics Packaging Technology Conference (EPTC) (01.12.2012)
Published in 2012 IEEE 14th Electronics Packaging Technology Conference (EPTC) (01.12.2012)
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Conference Proceeding
Modelling stress in silicon with TSVs and its effect on mobility
Selvanayagam, C. S., Zhang, Xiaowu, Rajoo, R., Pinjala, D.
Published in 2009 11th Electronics Packaging Technology Conference (01.12.2009)
Published in 2009 11th Electronics Packaging Technology Conference (01.12.2009)
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Conference Proceeding
Failure analyses of 3D Sip (system-in-package) and WLP (wafer-level package) by finite element methods
Lau, J., Xiaowu Zheng, Selvanayagam, C.
Published in 2009 16th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (01.07.2009)
Published in 2009 16th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (01.07.2009)
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Conference Proceeding
Through Silicon Via interposer for millimetre wave applications
Teck Guan Lim, Yee Mong Khoo, Selvanayagam, C. S., Ho, D. S. W., Rui Li, Xiaowu Zhang, Gao Shan, Xiong Yong Zhong
Published in 2011 IEEE 61st Electronic Components and Technology Conference (ECTC) (01.05.2011)
Published in 2011 IEEE 61st Electronic Components and Technology Conference (ECTC) (01.05.2011)
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Conference Proceeding