Innovative wafer level package manufacturing with FlexLineTM
Kang Chen, Kok Hwa Lim, Seah, Kenneth, Yaojian Lin, Seung Wook Yoon
Published in 2014 IEEE 16th Electronics Packaging Technology Conference (EPTC) (01.12.2014)
Published in 2014 IEEE 16th Electronics Packaging Technology Conference (EPTC) (01.12.2014)
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Conference Proceeding
Flash Memory for Stacked PoP Technology
Seah, Kenneth, Wong, Bertrand, Heng, Goh Swee, Leng, Tan Choon
Published in Advanced packaging (01.05.2008)
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Published in Advanced packaging (01.05.2008)
Magazine Article