Power Device Packaging Technologies for Extreme Environments
Johnson, R.W., Cai Wang, Yi Liu, Scofield, J.D.
Published in IEEE transactions on electronics packaging manufacturing (01.07.2007)
Published in IEEE transactions on electronics packaging manufacturing (01.07.2007)
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Journal Article
Effect of trimethylsilane flow rate on the growth of SiC thin-films for fiber-optic temperature sensors
Lin Cheng, Steckl, A.J., Scofield, J.D.
Published in Journal of microelectromechanical systems (01.12.2003)
Published in Journal of microelectromechanical systems (01.12.2003)
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Characteristics of High-Speed Silicon Carbide (Sic) Power Transistors
Asumadu, J.A., Scofield, J.D.
Published in 2007 IEEE Instrumentation & Measurement Technology Conference IMTC 2007 (01.05.2007)
Published in 2007 IEEE Instrumentation & Measurement Technology Conference IMTC 2007 (01.05.2007)
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Conference Proceeding
GaAs/Ge tandem-cell space concentrator development
Wojtczuk, S.J., Tobin, S.P., Keavney, C.J., Bajgar, C., Sanfacon, M.M., Geoffroy, L.M., Dixon, T.M., Vernon, S.M., Scofield, J.D., Ruby, D.S.
Published in IEEE transactions on electron devices (01.02.1990)
Published in IEEE transactions on electron devices (01.02.1990)
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Journal Article