Through Mold Via Development Using Laser Drilling Process for 3D Fan-out Wafer Level Package
Hsiao, Hsiang-Yao, Ho, David Soon Wee, Chong, Ser Choong, Chai, Tai Chong, Schutzberger, David, Oz, Yariv, Amrani, Guy
Published in 2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC) (07.12.2021)
Published in 2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC) (07.12.2021)
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Conference Proceeding
Laser drilling and Plasma Cleaning Process for Blind Via Through Mold Interconnect
Hsiao, Hsiang-Yao, Wee Ho, David Soon, Sing Lim, Keith Cheng, Chong, Ser Choong, Chai, Tai Chong, Schutzberger, David, Oz, Yariv, Amrani, Guy, Zhao, Jack, Toh, Johnson
Published in 2020 IEEE 22nd Electronics Packaging Technology Conference (EPTC) (02.12.2020)
Published in 2020 IEEE 22nd Electronics Packaging Technology Conference (EPTC) (02.12.2020)
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Conference Proceeding