Plating and Recrystallization of Galvanic Cu Films on Roll Annealed and Polycrystalline Cu Foils and the Effect of Intermediate Electroless Cu Layers
Bernhard, T., Massey, R., Li, Zhiou, Schulze, Joerg-F., Klaeden, K., Zarwell, S., Steinhaeuser, E., Bruening, F.
Published in 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) (01.05.2022)
Published in 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) (01.05.2022)
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