Exploring the process-microstructure-thermal properties relationship of resin-reinforced Ag sintering material for high-power applications via 3D FIB-SEM nanotomography
Hu, Xiao, Martin, Henry Antony, Poelma, René, Huang, Jianlin, van Rijckevorsel, Hans, Scholten, Huib, Smits, Edsger, van Driel, Willem D., Zhang, Guoqi
Published in Materials & design (01.08.2024)
Published in Materials & design (01.08.2024)
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Journal Article
Advanced reliability study on high temperature automotive electronics
Daoguo Yang, Dongjing Liu, van Driel, W D, Scholten, Huib, Goumans, L, Faria, R
Published in 2010 11th International Conference on Electronic Packaging Technology & High Density Packaging (01.08.2010)
Published in 2010 11th International Conference on Electronic Packaging Technology & High Density Packaging (01.08.2010)
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Conference Proceeding
FEM modelling of porosity in Ag sintering die attach for RF power applications
Huang, Jianlin, Scholten, Huib, de Bruijn, Frank, Xiao, An, de Vaan, Mario
Published in 2018 19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) (01.04.2018)
Published in 2018 19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) (01.04.2018)
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Conference Proceeding
Virtual thermo-mechanical prototyping for high-temperature-application microelectronics
Daoguo Yang, van Driel, W D, Scholten, Huib, Goumans, L, Faria, R
Published in 2010 11th International Thermal, Mechanical & Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems (EuroSimE) (01.04.2010)
Published in 2010 11th International Thermal, Mechanical & Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems (EuroSimE) (01.04.2010)
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Conference Proceeding