Void-free Copper Electrodeposition in High Aspect Ratio, Full Wafer Thickness Through-Silicon Vias with Endpoint Detection
Schmitt, Rebecca P., Menk, Lyle A., Baca, Ehren, Bower, John Eric, Romero, Joseph A., Jordan, Matthew B., Jackson, Nathan, Hollowell, Andrew E.
Published in Journal of the Electrochemical Society (01.12.2020)
Published in Journal of the Electrochemical Society (01.12.2020)
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Journal Article
Void-free Copper Electrodeposition in Full Wafer Thickness Through-Silicon Vias with a 10:1 Aspect Ratio
Schmitt, Rebecca P., Menk, Lyle Alexander, Baca, Ehren, Jordan, Matthew, Hollowell, Andrew E, Jackson, Nathan, Romero, Joseph A, Bower, John Eric
Published in Journal of the Electrochemical Society (01.09.2020)
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Published in Journal of the Electrochemical Society (01.09.2020)
Journal Article
Development of a Scalable Two-Additive Electrodeposition System for Bottom-up Copper Filling of Sub-Millimeter through Silicon Vias
Menk, Lyle Alexander, Schmitt, Rebecca Pauline, Han, Sang M, Jordan, Matthew, Sadler, Corrie, Hollowell, Andrew E
Published in Meeting abstracts (Electrochemical Society) (01.05.2020)
Published in Meeting abstracts (Electrochemical Society) (01.05.2020)
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Journal Article
Conference Proceeding