Nonlinear buckling analysis of vertical wafer probe technology
Hauck, Torsten, Müller, Wolfgang H., Schmadlak, Ilko
Published in Microsystem technologies : sensors, actuators, systems integration (01.11.2010)
Published in Microsystem technologies : sensors, actuators, systems integration (01.11.2010)
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Journal Article
Strength characterization of TEOS and FTEOS interlayer dielectric materials to compare fracture risk in die stack by 3D FE simulation approach
Lakhera, Nishant, Howell, Jim, Kipperman, Scott, Welsh, Evan, Schmadlak, Ilko
Published in 2017 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) (01.04.2017)
Published in 2017 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) (01.04.2017)
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Conference Proceeding
Flip chip laser mark bare die strength characterization
Muniandy, Kesvakumar, Schmadlak, Ilko, Yeung, Betty, Lauderdale, Matt, Uehling, Trent
Published in 2016 IEEE 18th Electronics Packaging Technology Conference (EPTC) (01.11.2016)
Published in 2016 IEEE 18th Electronics Packaging Technology Conference (EPTC) (01.11.2016)
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Conference Proceeding
Fracture risk assessment of laser marked die by means of simulation and test
Schmadlak, Ilko, Yeung, Betty, Morgan, Derek, Galles, Paul
Published in 2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (01.04.2015)
Published in 2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (01.04.2015)
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Conference Proceeding
Framework to extract cohesive zone parameters using double cantilever beam and four-point bend fracture tests
Raghavan, Sathyanarayanan, Schmadlak, Ilko, Leal, George, Sitaraman, Suresh K.
Published in 2014 15th International Conference on Thermal, Mechanical and Mulit-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) (01.04.2014)
Published in 2014 15th International Conference on Thermal, Mechanical and Mulit-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) (01.04.2014)
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Conference Proceeding
Interlayer dielectric cracking in back end of line (BEOL) stack
Raghavan, S., Schmadlak, I., Sitaraman, S. K.
Published in 2012 IEEE 62nd Electronic Components and Technology Conference (01.05.2012)
Published in 2012 IEEE 62nd Electronic Components and Technology Conference (01.05.2012)
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Conference Proceeding
Power QFN down bond lift and delamination study
Hanmin Zhang, Hu, M., Wang, Sonder, Ilko, Schmadlak, Yin, B. G., He, Q. C., Ye, D. H.
Published in 2014 IEEE 16th Electronics Packaging Technology Conference (EPTC) (01.12.2014)
Published in 2014 IEEE 16th Electronics Packaging Technology Conference (EPTC) (01.12.2014)
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Conference Proceeding
Simulation of Wafer Probing Process Considering Probe Needle Dynamics
Schmadlak, I., Hauck, T.
Published in 2007 International Conference on Thermal, Mechanical and Multi-Physics Simulation Experiments in Microelectronics and Micro-Systems. EuroSime 2007 (01.04.2007)
Published in 2007 International Conference on Thermal, Mechanical and Multi-Physics Simulation Experiments in Microelectronics and Micro-Systems. EuroSime 2007 (01.04.2007)
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Conference Proceeding
Stress analysis of a micro-machined inertial sensor at dynamic load
Hauck, T., Schmadlak, I., Mehner, J.
Published in 2008 11th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (01.05.2008)
Published in 2008 11th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (01.05.2008)
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Conference Proceeding
Damage risk assessment of under-pad structures in vertical wafer probe technology
Hauck, T., Schmadlak, I., Argento, C., Muller, W.H.
Published in 2009 European Microelectronics and Packaging Conference (01.06.2009)
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Published in 2009 European Microelectronics and Packaging Conference (01.06.2009)
Conference Proceeding
INTEGRATED CIRCUIT MOUNTING FOR THERMAL STRESS RELIEF USEABLE IN A MULTI-CHIP MODULE
BIANCO, GERRY, BROSZEIT, JUERGEN, GAYOWSKY, GREGORY R, SOTIROPOULOS, GEORGE, ALHAYEK, IYAD, SCHMADLAK, ILKO
Year of Publication 22.09.2010
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Year of Publication 22.09.2010
Patent
Integrated circuit mounting for thermal stress relief useable in a multi-chip module
Alhayek, Iyad, Bianco, Gerry, Broszeit, Juergen, Gayowsky, Gregory R, Schmadlak, Ilko, Sotiropoulos, George
Year of Publication 21.04.2009
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Year of Publication 21.04.2009
Patent