by Zhang, K., Schlottig, G., Mengotti, E., Quittard, O., Iannuzzo, F.
Published in Microelectronics and reliability (01.11.2020)

by Ernst, L.J., Xiao, A., De Vreugd, J., Jansen, K.M.B., Pape, H., Schlottig, G., Wunderle, B.
Published in 2009 IEEE 70th Vehicular Technology Conference Fall (01.09.2009)

by Kumar, S. G., Zschenderlein, U., Pantou, R., Brunschwiler, T., Schlottig, G., Schindler-Saefkow, F., Wunderle, B.
Published in 2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (01.04.2015)

by Xiao, A, Schlottig, G, Pape, H, Wunderle, B, Jansen, K M B, Ernst, L J
Published in 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC) (01.06.2010)

by Keller, J, Maus, I, Schlottig, G, Pape, H, Wunderle, B, Michel, B
Published in 3rd Electronics System Integration Technology Conference ESTC (01.09.2010)

by Schlottig, G, Maus, I, Walter, H, Jansen, K, Pape, H, Wunderle, B, Ernst, L J
Published in 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC) (01.06.2010)

by Sadeghinia, M, Jansen, K M B, Ernst, L J, Schlottig, G, Pape, H
Published in 2011 12th Intl. Conf. on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (01.04.2011)

by Xiao, A, Pape, H, Schlottig, G, Wunderle, W, Leung, Y Y, Jansen, K M B, Ernst, L J
Published in 2010 11th International Conference on Electronic Packaging Technology & High Density Packaging (01.08.2010)

by Uhlemann, J., Schindler, S., Schlottig, G., Drechsler, M., Starcke, S., Vollmer, G., Wolter, K.-J.
Published in Proceedings Electronic Components and Technology, 2005. ECTC '05 (2005)

by Kleff, J., Schlottig, G., Mrossko, R., Steller, W., Oppermann, H., Keller, J., Brunschwiler, T.
Published in 2016 6th Electronic System-Integration Technology Conference (ESTC) (01.09.2016)

by Brunschwiler, T., Schlottig, G., Sridhar, A., Bezerra, P., Ruch, P., Ebejer, N., Oppermann, H., Kleff, J., Steller, W., Jatlaoui, M., Voiron, F., Pavlovic, Z., McCloskey, P., Bremner, D., Parida, P., Krismer, F., Kolar, J., Michel, B.
Published in 2017 IEEE International Electron Devices Meeting (IEDM) (01.12.2017)

by Burg, Brian R., Zurcher, J., Schlottig, G., Chen, X., Brunschwiler, T.
Published in 2015 European Microelectronics Packaging Conference (EMPC) (01.09.2015)

by Schlottig, G., Pape, H., Wunderle, B., Ernst, L. J.
Published in 2011 IEEE 61st Electronic Components and Technology Conference (ECTC) (01.05.2011)

by Wunderle, B., Schulz, M., Keller, J., Schlottig, G., Maus, I., May, D., Holck, O., Pape, H., Michel, B.
Published in 2011 IEEE 61st Electronic Components and Technology Conference (ECTC) (01.05.2011)

by Sadeghinia, M., Jansen, K. M. B., Ernst, L. J., Schlottig, G., Pape, H.
Published in 2011 IEEE 61st Electronic Components and Technology Conference (ECTC) (01.05.2011)

by Schlottig, G., Brunschwiler, T., Goicochea, J., Escher, W., Michel, B.
Published in 2012 13th International Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (01.04.2012)

by Schlottig, G., Pape, H., An Xiao, Wunderle, B., Ernst, L.
Published in 2009 11th Electronics Packaging Technology Conference (01.12.2009)

by Schlottig, G., Pape, H., Wunderle, B., Ernst, L.J.
Published in EuroSimE 2009 - 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (01.04.2009)

by Xiao, A., Schlottig, G., Pape, H., Wunderle, B., Jansen, K., Ernst, L.J.
Published in 2008 International Conference on Electronic Packaging Technology & High Density Packaging (01.07.2008)

by Schlottig, G., Rebenklau, L., Uhlemann, J., Nytsch-Geusen, C., Wolter, K.J.
Published in 2006 1st Electronic Systemintegration Technology Conference (01.09.2006)