Piezoresistive Characteristics of MOSFET Channels Determined With Indentation
Schlipf, S., Clausner, A., Paul, J., Capecchi, S., Wambera, L., Meier, K., Zschech, E.
Published in IEEE transactions on electron devices (01.04.2021)
Published in IEEE transactions on electron devices (01.04.2021)
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Journal Article
SAT0614 New variant in the il1rn-gene associated with late onset and atypical presentation of dira
Kuemmerle-Deschner, J.B., Hoertnagel, K., Schlipf, S., Hansmann, S., Hospach, A., Liu, X., Benseler, S.M., Weber, A.N.
Published in Annals of the rheumatic diseases (01.06.2018)
Published in Annals of the rheumatic diseases (01.06.2018)
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Journal Article
Impact of Mechanical Strain on 22 nm FDSOI Device Performance using Nanoindentation
Schlipf, S., Clausner, A., Paul, J., Capecchi, S., Kurz, G., Zschech, E.
Published in 2019 IEEE International Integrated Reliability Workshop (IIRW) (01.10.2019)
Published in 2019 IEEE International Integrated Reliability Workshop (IIRW) (01.10.2019)
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Conference Proceeding
Nanoindentation to investigate IC stability using ring oscillator circuits as a CPI sensor
Schlipf, S., Clausner, A., Paul, J., Capecchi, S., Wambera, L., Meier, K., Zschech, E.
Published in 2020 IEEE International Reliability Physics Symposium (IRPS) (01.04.2020)
Published in 2020 IEEE International Reliability Physics Symposium (IRPS) (01.04.2020)
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Conference Proceeding
Macro- and Microscopic DMA measurements - Complementary techniques to determine viscoelastic material properties of packaging polymers
Clausner, A., Schlipf, S., Sander, C., Schwerz, R., Roellig, M.
Published in 2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) (25.04.2022)
Published in 2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) (25.04.2022)
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Conference Proceeding
The Expressive Powers of the Logic Programming Semantics
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Journal Article
Conference Proceeding
On finding solutions for extended Horn formulas
Schlipf, John S., Annexstein, Fred S., Franco, John V., Swaminathan, R.P.
Published in Information processing letters (12.05.1995)
Published in Information processing letters (12.05.1995)
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Journal Article
Shear stress effects on the device characteristics determined with indentation testing : Student paper
Schlipf, S., Clausner, A., Paul, J., Capecchi, S., Zschech, E.
Published in 2021 IEEE International Integrated Reliability Workshop (IIRW) (04.10.2021)
Published in 2021 IEEE International Integrated Reliability Workshop (IIRW) (04.10.2021)
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Conference Proceeding
Prediction of SRAM Reliability Under Mechanical Stress Induced by Harsh En§ironments
Warmuth, J., Giering, K.-U., Lange, A., Clausner, A., Schlipf, S., Kurz, G., Otto, M., Paul, J., Jancke, R., Aal, A., Gall, M., Zschech, E.
Published in 2018 48th European Solid-State Device Research Conference (ESSDERC) (01.09.2018)
Published in 2018 48th European Solid-State Device Research Conference (ESSDERC) (01.09.2018)
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Conference Proceeding
Analysis of 28 nm SRAM cell stability under mechanical load applied by nanoindentation
Clausner, A., Schlipf, S., Kurz, G., Otto, M., Paul, J., Giering, K.-U., Warmuth, J., Lange, A., Jancke, R., Aal, A., Rosenkranz, R., Gall, M., Zschech, E.
Published in 2018 IEEE International Reliability Physics Symposium (IRPS) (01.03.2018)
Published in 2018 IEEE International Reliability Physics Symposium (IRPS) (01.03.2018)
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Conference Proceeding
Unique satisfiability of Horn sets can be solved in nearly linear time
Berman, Kenneth A., Franco, John, Schlipf, John S.
Published in Discrete Applied Mathematics (23.06.1995)
Published in Discrete Applied Mathematics (23.06.1995)
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Journal Article
Cylindrical Indentation to Selectively Stress Nanoscale CMOS Transistors
Schlipf, S., Clausner, A., Paul, J., Capecchi, S., Zschech, E.
Published in IEEE transactions on device and materials reliability (01.09.2022)
Published in IEEE transactions on device and materials reliability (01.09.2022)
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Magazine Article
Bcl-x sub(S) induces an NGF-inhibitable cytochrome c release
Lindenboim, L, Schlipf, S, Kaufmann, T, Borner, C, Stein, R
Published in Experimental cell research (01.07.2004)
Published in Experimental cell research (01.07.2004)
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Journal Article
Stress-Induced Transistor Degradation Studied by an Indentation Approach
Schlipf, S., Clausner, A., Paul, J., Capecchi, S., Wambera, L., Meier, K., Zschech, E.
Published in IEEE transactions on device and materials reliability (01.03.2021)
Published in IEEE transactions on device and materials reliability (01.03.2021)
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Magazine Article
Bcl-x(S) induces an NGF-inhibitable cytochrome c release
Lindenboim, Liora, Schlipf, Sarah, Kaufmann, Thomas, Borner, Christoph, Stein, Reuven
Published in Experimental cell research (15.07.2004)
Published in Experimental cell research (15.07.2004)
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Journal Article
IC package related stress effects on the characteristics of ring oscillator circuits
Schlipf, S., Sander, C., Clausner, A., Paul, J., Capecchi, S., Wambera, L., Meier, K., Zschech, E.
Published in 2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) (19.04.2021)
Published in 2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) (19.04.2021)
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Conference Proceeding