Al-Al thermocompression bonding for wafer-level MEMS sealing
Malik, N, Schjolberg-Henriksen, K, Poppe, E, Taklo, M MVisser, Finstad, T G
Published in Sensors and actuators. A. Physical. (01.05.2014)
Published in Sensors and actuators. A. Physical. (01.05.2014)
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Journal Article
Methods for characterization of wafer-level encapsulation applied on silicon to LTCC anodic bonding
Khan, M F, Ghavanini, F A, Haasl, S, Löfgren, L, Persson, K, Rusu, C, Schjølberg-Henriksen, K, Enoksson, P
Published in Journal of micromechanics and microengineering (01.06.2010)
Published in Journal of micromechanics and microengineering (01.06.2010)
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Conference Proceeding
High-resolution pressure sensor for photo acoustic gas detection
Schjølberg-Henriksen, K., Wang, D.T., Rogne, H., Ferber, A., Vogl, A., Moe, S., Bernstein, R., Lapadatu, D., Sandven, K., Brida, S.
Published in Sensors and actuators. A. Physical. (08.11.2006)
Published in Sensors and actuators. A. Physical. (08.11.2006)
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Journal Article
Low-Temperature Aluminum-Aluminum Wafer Bonding
Rebhan, Bernhard, Hinterreiter, Andreas, Malik, Nishant, Schjølberg-Henriksen, Kari, Dragoi, Viorel, Hingerl, Kurt
Published in ECS transactions (24.08.2016)
Published in ECS transactions (24.08.2016)
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Journal Article
Fabrication process for CMUT arrays with polysilicon electrodes, nanometre precision cavity gaps and through-silicon vias
Due-Hansen, J, Midtbø, K, Poppe, E, Summanwar, A, Jensen, G U, Breivik, L, Wang, D T, Schjølberg-Henriksen, K
Published in Journal of micromechanics and microengineering (01.07.2012)
Published in Journal of micromechanics and microengineering (01.07.2012)
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Journal Article
Conference Proceeding
Environmental Stress Testing of Wafer-Level Au-Au Thermocompression Bonds Realized at Low Temperature: Strength and Hermeticity
Malik, N., Tofteberg, H. R., Poppe, E., Finstad, T. G., Schjølberg-Henriksen, K.
Published in ECS journal of solid state science and technology (01.01.2015)
Published in ECS journal of solid state science and technology (01.01.2015)
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Journal Article
Hermeticity and Reliability of Au-Au Thermocompression Bonds, Realized at Low Temperature
Malik, Nisant, Tofteberg, Hannah, Poppe, Erik, Finstad, Terje G, Schjolberg-Henriksen, Kari
Published in ECS transactions (14.08.2014)
Published in ECS transactions (14.08.2014)
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Journal Article
Hermeticity and Reliability of Al-Al Thermocompression Wafer Bonding
Malik, Nisant, Poppe, Erik, Schjolberg-Henriksen, Kari, Taklo, Maaike Margrete Visser, Finstad, Terje G
Published in ECS transactions (14.08.2014)
Published in ECS transactions (14.08.2014)
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Journal Article
Electrical, Mechanical, and Hermeticity Properties of Low-Temperature, Plasma Activated Direct Silicon Bonded Joints
Schjølberg-Henriksen, Kari, Malik, Nishant, Gundersen, Elin Vold, Christiansen, Oscar Rincon, Imenes, Kristin, Moe, Sigurd Teodor
Published in ECS transactions (14.08.2014)
Published in ECS transactions (14.08.2014)
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Journal Article
Electrical, Mechanical, and Hermetic Properties of Low-Temperature, Plasma Activated Direct Silicon Bonded Joints
Schjølberg-Henriksen, K., Malik, N., Gundersen, E. V., Christiansen, O. R., Imenes, K., Fournel, F., Moe, S.
Published in ECS journal of solid state science and technology (01.01.2015)
Published in ECS journal of solid state science and technology (01.01.2015)
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Journal Article
Sensitive and Selective Photoacoustic Gas Sensor Suitable for High-Volume Manufacturing
Schjolberg-Henriksen, K., Schulz, O., Ferber, A., Moe, S., Lloyd, M., Muller, G., Suphan, K.-H., Wang, D.T., Bernstein, R.W.
Published in IEEE sensors journal (01.09.2008)
Published in IEEE sensors journal (01.09.2008)
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Journal Article
High-frequency CMUT arrays with phase-steering for in vivo ultrasound imaging
Midtbo, K., Ronnekleiv, A., Ingebrigtsen, K. A., Due-Hansen, J., Poppe, E., Wang, D. T., Jensen, G. U., Schjolberg-Henriksen, K.
Published in 2012 IEEE Sensors (01.10.2012)
Published in 2012 IEEE Sensors (01.10.2012)
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Conference Proceeding
Anodic bonding of glass to aluminium
SCHJØLBERG-HENRIKSEN, K, POPPE, E, MOE, S, STORAS, P, TAKLO, M. M. V, WANG, D. T, JAKOBSEN, H
Published in Microsystem technologies : sensors, actuators, systems integration (01.04.2006)
Published in Microsystem technologies : sensors, actuators, systems integration (01.04.2006)
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Journal Article
Capacitive differential pressure sensor for harsh environments
Moe, S.T, Schjølberg-Henriksen, K, Wang, D.T, Lund, E, Nysæther, J, Furuberg, L, Visser, M, Fallet, T, Bernstein, R.W
Published in Sensors and actuators. A. Physical. (22.05.2000)
Published in Sensors and actuators. A. Physical. (22.05.2000)
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Journal Article
AlAl thermocompression bonding for wafer-level MEMS sealing
Malik, N., Schjølberg-Henriksen, K., Poppe, E., Taklo, M.M.Visser, Finstad, T.G.
Published in Sensors and actuators. A. Physical. (01.05.2014)
Published in Sensors and actuators. A. Physical. (01.05.2014)
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Journal Article