Fabrication process for CMUT arrays with polysilicon electrodes, nanometre precision cavity gaps and through-silicon vias
Due-Hansen, J, Midtbø, K, Poppe, E, Summanwar, A, Jensen, G U, Breivik, L, Wang, D T, Schjølberg-Henriksen, K
Published in Journal of micromechanics and microengineering (01.07.2012)
Published in Journal of micromechanics and microengineering (01.07.2012)
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Journal Article
Conference Proceeding
Al-Al thermocompression bonding for wafer-level MEMS sealing
Malik, N, Schjolberg-Henriksen, K, Poppe, E, Taklo, M MVisser, Finstad, T G
Published in Sensors and actuators. A. Physical. (01.05.2014)
Published in Sensors and actuators. A. Physical. (01.05.2014)
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Journal Article
Anodic bonding of glass to aluminium
SCHJØLBERG-HENRIKSEN, K, POPPE, E, MOE, S, STORAS, P, TAKLO, M. M. V, WANG, D. T, JAKOBSEN, H
Published in Microsystem technologies : sensors, actuators, systems integration (01.04.2006)
Published in Microsystem technologies : sensors, actuators, systems integration (01.04.2006)
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Journal Article
Capacitive differential pressure sensor for harsh environments
Moe, S.T, Schjølberg-Henriksen, K, Wang, D.T, Lund, E, Nysæther, J, Furuberg, L, Visser, M, Fallet, T, Bernstein, R.W
Published in Sensors and actuators. A. Physical. (22.05.2000)
Published in Sensors and actuators. A. Physical. (22.05.2000)
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Journal Article
AlAl thermocompression bonding for wafer-level MEMS sealing
Malik, N., Schjølberg-Henriksen, K., Poppe, E., Taklo, M.M.Visser, Finstad, T.G.
Published in Sensors and actuators. A. Physical. (01.05.2014)
Published in Sensors and actuators. A. Physical. (01.05.2014)
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Journal Article
Electrical effects of anodic bonding on silicon dioxide situated in Pyrex cavities
SCHJØLBERG-HENRIKSEN, K, HANNEBORG, A. B, JENSEN, G. U, LAPADATU, A. C, JAKOBSEN, H
Published in Journal of the Electrochemical Society (01.08.2002)
Published in Journal of the Electrochemical Society (01.08.2002)
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Journal Article
Protection of MOS capacitors during anodic bonding
Schjølberg-Henriksen, K, Plaza, J A, Rafí, J M, Esteve, J, Campabadal, F, Santander, J, Jensen, G U, Hanneborg, A
Published in Journal of micromechanics and microengineering (01.07.2002)
Published in Journal of micromechanics and microengineering (01.07.2002)
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Journal Article
Conference Proceeding
Methods for characterization of wafer-level encapsulation applied on silicon to LTCC anodic bonding
Khan, M F, Ghavanini, F A, Haasl, S, Löfgren, L, Persson, K, Rusu, C, Schjølberg-Henriksen, K, Enoksson, P
Published in Journal of micromechanics and microengineering (01.06.2010)
Published in Journal of micromechanics and microengineering (01.06.2010)
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Journal Article
Conference Proceeding
Anodic bonding for monolithically integrated MEMS
Schjølberg-Henriksen, K., Jensen, G.U., Hanneborg, A., Jakobsen, H.
Published in Sensors and actuators. A. Physical. (01.09.2004)
Published in Sensors and actuators. A. Physical. (01.09.2004)
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Journal Article
High-resolution pressure sensor for photo acoustic gas detection
Schjølberg-Henriksen, K., Wang, D.T., Rogne, H., Ferber, A., Vogl, A., Moe, S., Bernstein, R., Lapadatu, D., Sandven, K., Brida, S.
Published in Sensors and actuators. A. Physical. (08.11.2006)
Published in Sensors and actuators. A. Physical. (08.11.2006)
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Journal Article
Environmental Stress Testing of Wafer-Level Au-Au Thermocompression Bonds Realized at Low Temperature: Strength and Hermeticity
Malik, N., Tofteberg, H. R., Poppe, E., Finstad, T. G., Schjølberg-Henriksen, K.
Published in ECS journal of solid state science and technology (2015)
Published in ECS journal of solid state science and technology (2015)
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Journal Article
Sodium contamination of SiO2 caused by anodic bonding
Schjølberg-Henriksen, K, Jensen, G U, Hanneborg, A, Jakobsen, H
Published in Journal of micromechanics and microengineering (01.11.2003)
Published in Journal of micromechanics and microengineering (01.11.2003)
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Journal Article
Low-Temperature Aluminum-Aluminum Wafer Bonding
Rebhan, Bernhard, Hinterreiter, Andreas, Malik, Nishant, Schjølberg-Henriksen, Kari, Dragoi, Viorel, Hingerl, Kurt
Published in ECS transactions (24.08.2016)
Published in ECS transactions (24.08.2016)
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Journal Article
Oxide charges induced by plasma activation for wafer bonding
Schjølberg-Henriksen, K., Visser Taklo, M.M., Hanneborg, A., Jensen, G.U.
Published in Sensors and actuators. A. Physical. (01.12.2002)
Published in Sensors and actuators. A. Physical. (01.12.2002)
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Journal Article
Modelling of charging effects caused by anodic bonding in packaged MOS devices
Schjølberg-Henriksen, K., Fjeldly, T.A., Santander, J., Plaza, J.A., Hanneborg, A.
Published in Electronics letters (21.11.2002)
Published in Electronics letters (21.11.2002)
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Journal Article
Environmental Stress Testing of Wafer-Level Au-Au Thermocompression Bonds Realized at Low Temperature: Strength and Hermeticity
Malik, N., Tofteberg, H. R., Poppe, E., Finstad, T. G., Schjølberg-Henriksen, K.
Published in ECS journal of solid state science and technology (01.01.2015)
Published in ECS journal of solid state science and technology (01.01.2015)
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Journal Article
Hermeticity and Reliability of Au-Au Thermocompression Bonds, Realized at Low Temperature
Malik, Nisant, Tofteberg, Hannah, Poppe, Erik, Finstad, Terje G, Schjolberg-Henriksen, Kari
Published in ECS transactions (14.08.2014)
Published in ECS transactions (14.08.2014)
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