Thermo-Compression Bonding and Mass Reflow Assembly Processes of 3D Logic Die Stacks
Gagnon, Pascale, Bergeron, Christian, Langlois, Richard, Barbeau, Stephane, Whitehead, Steve, Tyberg, Christy, Robertazzi, Ray, Sakuma, Katsuyuki, Wordeman, Matthew, Scheurmann, Michael
Published in 2017 IEEE 67th Electronic Components and Technology Conference (ECTC) (01.05.2017)
Published in 2017 IEEE 67th Electronic Components and Technology Conference (ECTC) (01.05.2017)
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Conference Proceeding
Quantum Potential Theory
Biane, Philippe, Bouten, Luc, Cipriani, Fabio, Konno, Norio, Privault, Nicolas, Xu, Quanhua, Franz, Uwe, Schuermann, Michael
Year of Publication 2008
Year of Publication 2008
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HALTE- UND JUSTIERVORRICHTUNG FUER STUETZEN IN HUELSENFUNDAMENTEN
HOEPPNER,REIMAR,DD, LEHMANN,BERND,DD, STEIER,THOMAS,DD, WEISKE,JENS,DD, SCHEUERMANN,MICHAEL,DD
Year of Publication 10.10.1984
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Year of Publication 10.10.1984
Patent