Thin film integration of passives - single components, filters, integrated passive devices
Zoschke, K., Wolf, J., Topper, M., Ehrmann, O., Fritzsch, T., Scherpinski, K., Reichl, H., Schmuckle, F.-J.
Published in 2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE Cat. No.04CH37546) (2004)
Published in 2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE Cat. No.04CH37546) (2004)
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Conference Proceeding
Fabrication of application specific integrated passive devices using wafer level packaging technologies
Zoschke, K., Wolf, J., Topper, M., Ehrmann, O., Fritzsch, T., Scherpinski, K., Reichl, H., Schmuckle, F.-J.
Published in Proceedings Electronic Components and Technology, 2005. ECTC '05 (2005)
Published in Proceedings Electronic Components and Technology, 2005. ECTC '05 (2005)
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Conference Proceeding
Wafer-level chip size package (WL-CSP)
Topper, M., Fehlberg, S., Scherpinski, K., Karduck, C., Glaw, V., Heinricht, K., Coskina, P., Ehrmann, O., Reichl, H.
Published in IEEE transactions on advanced packaging (01.05.2000)
Published in IEEE transactions on advanced packaging (01.05.2000)
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Journal Article
Conference Proceeding
Integration of NiCr resistors in a multilayer Cu/BCB wiring system
Scherpinski, K., Topper, M., Krause, F., Halser, K., Hahn, R., Ehrmann, O., Reichl, H.
Published in Proceedings International Symposium on Advanced Packaging Materials. Processes, Properties and Interfaces (IEEE Cat. No.99TH8405) (1999)
Published in Proceedings International Symposium on Advanced Packaging Materials. Processes, Properties and Interfaces (IEEE Cat. No.99TH8405) (1999)
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Conference Proceeding
Stackable thin film multi layer substrates with integrated passive components
Zoschke, K., Buschick, K., Scherpinski, K., Fischer, T., Wolf, J., Ehrmann, O., Jordan, R., Reichl, H., Schmiickle, F.-J.
Published in 56th Electronic Components and Technology Conference 2006 (2006)
Published in 56th Electronic Components and Technology Conference 2006 (2006)
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Conference Proceeding
Thin film substrate technology and FC interconnection for very high frequency applications
Topper, M., Rosin, T., Fritzsch, T., Jordan, R., Mekonnen, G., Sakkas, C., Kunkel, R., Scherpinski, K., Schmidt, D., Oppermann, H., Dietrich, L., Beling, A., Eckhardt, T., Bach, H.-G., Reichl, H.
Published in 56th Electronic Components and Technology Conference 2006 (2006)
Published in 56th Electronic Components and Technology Conference 2006 (2006)
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Conference Proceeding
Combination of MCM-C technology with MCM-D technology using photosensitive polymers
Topper, M., Scherpinski, K., Hahn, R., Ehrmann, O., Reichl, H., Schmaus, C., Bechtold, F.
Published in Proceedings. 4th International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces (Cat. No.98EX153) (1998)
Published in Proceedings. 4th International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces (Cat. No.98EX153) (1998)
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Conference Proceeding