Comparing impact on the family and insurance coverage in children with cerebral palsy and children with another special healthcare need
Schaible, B., Colquitt, G., Caciula, M. C., Carnes, A., Li, L., Moreau, N.
Published in Child : care, health & development (01.05.2018)
Published in Child : care, health & development (01.05.2018)
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Journal Article
WS14.3 Hypoxia reduces the virulence of Pseudomonas aeruginosa
Schaible, B, Rodriguez, J, Garcia, A, Kriegsheim, A. von, McClean, S, Taylor, C.T, Schaffer, K
Published in Journal of cystic fibrosis (01.06.2016)
Published in Journal of cystic fibrosis (01.06.2016)
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Journal Article
70 Expression of RND-type efflux pumps as a mechanism of antibiotic resistance in clinical Prevotella isolates
Sherrard, L, Schaible, B, Gilpin, D.F, Elborn, J.S, Tunney, M
Published in Journal of cystic fibrosis (01.06.2014)
Published in Journal of cystic fibrosis (01.06.2014)
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Journal Article
83 Investigation of RND efflux pumps in clinical Prevotella species isolated from CF patients
Schaible, B, Sherrard, L, Gilpin, D.F, Elborn, J.S, Tunney, M
Published in Journal of cystic fibrosis (01.06.2013)
Published in Journal of cystic fibrosis (01.06.2013)
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Journal Article
Thermosonic flip-chip bonding using longitudinal ultrasonic vibration
Qing Tan, Wenge Zhang, Schaible, B., Bond, L.J., Teh-Hua Ju, Yung-Cheng Lee
Published in IEEE transactions on components, packaging, and manufacturing technology. Part B, Advanced packaging (01.02.1998)
Published in IEEE transactions on components, packaging, and manufacturing technology. Part B, Advanced packaging (01.02.1998)
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Journal Article
Thermosonic flip-chip bonding system with a self-planarization feature using polymer
Qing Tan, Schaible, B., Bond, L.J., Yung-Cheng Lee
Published in IEEE transactions on advanced packaging (01.08.1999)
Published in IEEE transactions on advanced packaging (01.08.1999)
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Journal Article
Conference Proceeding
Thermosonic flip chip bonding system with a self-planarization feature using polymer
Qing Tan, Schaible, B., Bond, L.J., Lee, Y.C.
Published in 1998 Proceedings. 48th Electronic Components and Technology Conference (Cat. No.98CH36206) (1998)
Published in 1998 Proceedings. 48th Electronic Components and Technology Conference (Cat. No.98CH36206) (1998)
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Conference Proceeding
Journal Article
Efficient design using fuzzy logic based regression models
Schaible, B., Yung-Chang Lee, Hong Xie
Published in IEEE transactions on components, packaging, and manufacturing technology. Part A (01.03.1998)
Published in IEEE transactions on components, packaging, and manufacturing technology. Part A (01.03.1998)
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Journal Article
Efficient design using fuzzy logic based regression models
Schaible, B., Lee, Y.C., Xie, H.
Published in 1997 Proceedings 47th Electronic Components and Technology Conference (1997)
Published in 1997 Proceedings 47th Electronic Components and Technology Conference (1997)
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Conference Proceeding
Thermosonic flip-chip bonding using longitudinal ultrasonic vibration
Qing Tan, Wenge Zhang, Schaible, B., Bond, L.J., Ju, T.H., Lee, Y.C.
Published in 1997 Proceedings 47th Electronic Components and Technology Conference (1997)
Published in 1997 Proceedings 47th Electronic Components and Technology Conference (1997)
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Conference Proceeding
Novel homozygous p.E64D mutation in DJ1 in early onset Parkinson disease (PARK7)
Hering, Robert, Strauss, Karsten M., Tao, Xiao, Bauer, Andreas, Woitalla, Dirk, Mietz, Eva-Maria, Petrovic, Slobodanka, Bauer, Peter, Schaible, Wilhelm, Müller, Thomas, Schöls, Ludger, Klein, Christine, Berg, Daniela, Meyer, Philipp T., Schulz, Jörg B., Wollnik, Bernd, Tong, Liang, Krüger, Rejko, Riess, Olaf
Published in Human mutation (01.10.2004)
Published in Human mutation (01.10.2004)
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Journal Article
Digital control of a positioning device for a ventilation machine
Jenayeh, I., Simon, F., Bernhard, S., Rake, H., Schaible, B.
Published in 1997 European Control Conference (ECC) (01.07.1997)
Published in 1997 European Control Conference (ECC) (01.07.1997)
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Conference Proceeding