Nature and Location of Cationic Lanthanum Species in High Alumina Containing Faujasite Type Zeolites
Schüßler, Florian, Pidko, Evgeny A, Kolvenbach, Robin, Sievers, Carsten, Hensen, Emiel J. M, van Santen, Rutger A, Lercher, Johannes A
Published in Journal of physical chemistry. C (10.11.2011)
Published in Journal of physical chemistry. C (10.11.2011)
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Journal Article
ENHANCING MENISCUS IMPLANT BIOMECHANICS: AN IN-SILICO ANALYSIS THROUGH 3D PRINTING
Moser, Anna-Christina, Fritz, Jennifer, Otahal, Alexander, Kesselring, Andreas, Florian, Schüssler, Schneider, Karl H., Teuschl-Woller, Andreas, Nehrer, Stefan
Published in Osteoarthritis and cartilage (01.04.2024)
Published in Osteoarthritis and cartilage (01.04.2024)
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Journal Article
093 - ENHANCING MENISCUS IMPLANT BIOMECHANICS: AN IN-SILICO ANALYSIS THROUGH 3D PRINTING
Moser, Anna-Christina, Fritz, Jennifer, Otahal, Alexander, Kesselring, Andreas, Florian, Schüssler, Schneider, Karl H., Teuschl-Woller, Andreas, Nehrer, Stefan
Published in Osteoarthritis and cartilage (01.04.2024)
Published in Osteoarthritis and cartilage (01.04.2024)
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Journal Article
Plasma-printing and galvanic metallization hand in hand—A new technology for the cost-efficient manufacture of flexible printed circuits
Möbius, Andreas, Elbick, Danica, Weidlich, Ernst-Rudolf, Feldmann, Klaus, Schüßler, Florian, Borris, Jochen, Thomas, Michael, Zänker, Antje, Klages, Claus-Peter
Published in Electrochimica acta (30.03.2009)
Published in Electrochimica acta (30.03.2009)
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Journal Article
Conference Proceeding
Sorption and diffusion parameters from vacuum-TPD of ammonia on H-ZSM-5
Kouva, Sonja, Kanervo, Jaana, Schüβler, Florian, Olindo, Roberta, Lercher, Johannes A., Krause, Outi
Published in Chemical engineering science (01.02.2013)
Published in Chemical engineering science (01.02.2013)
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Journal Article
Reliability aspects of electronic devices for advanced requirements
Schüßler, Florian, Rösch, Michael, Hörber, Johannes, Feldmann, Klaus
Published in Circuit world (22.08.2008)
Published in Circuit world (22.08.2008)
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Journal Article
Adapted assembly processes for flip-chip technology with solder bumps of 50 µm or 40 µm diameter
Dohle, Rainer, Schüssler, Florian, Friedrich, Thomas, Gossler, Jörg, Oppert, Thomas, Franke, Jörg
Published in 3rd Electronics System Integration Technology Conference ESTC (01.09.2010)
Published in 3rd Electronics System Integration Technology Conference ESTC (01.09.2010)
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Conference Proceeding
Processing and reliability analysis of flip-chips with solder bumps down to 30 μm diameter
Franke, J., Dohle, R., Schusler, F., Oppert, T., Friedrich, T., Harter, S.
Published in 2011 IEEE 61st Electronic Components and Technology Conference (ECTC) (01.05.2011)
Published in 2011 IEEE 61st Electronic Components and Technology Conference (ECTC) (01.05.2011)
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Conference Proceeding
Fertigungstechnik in Erlangen: Lehrstuhl für Fertigunsgtechnologie und Lehrstuhl für Fertigungsautomatisierung und Produktionssystematik
Feldmann, Klaus, Geiger, Manfred, Kreis, Oliver, Schüßler, Florian
Published in Zeitschrift für wirtschaftlichen Fabrikbetrieb (27.03.2007)
Published in Zeitschrift für wirtschaftlichen Fabrikbetrieb (27.03.2007)
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Magazine Article
Fertigungstechnik in Erlangen
Feldmann, Klaus, Geiger, Manfred, Kreis, Oliver, Schüßler, Florian
Published in Zeitschrift für wirtschaftlichen Fabrikbetrieb (27.03.2007)
Published in Zeitschrift für wirtschaftlichen Fabrikbetrieb (27.03.2007)
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Magazine Article
Qualifizierung elektronischer Baugruppen
Feldmann, Klaus, Schüßler, Florian, Hörber, Johannes
Published in Zeitschrift für wirtschaftlichen Fabrikbetrieb (28.06.2008)
Published in Zeitschrift für wirtschaftlichen Fabrikbetrieb (28.06.2008)
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Magazine Article