2N Au wire bonding for ultra fine picth BGA
Eu Poh Leng, Yong, C.C., Chin Teck Siong, Masahiro, T., Vo, N., Lee Boon Seong, Faizal, Z.-K.M., Sazilawati, F.
Published in 2009 11th Electronics Packaging Technology Conference (01.12.2009)
Published in 2009 11th Electronics Packaging Technology Conference (01.12.2009)
Get full text
Conference Proceeding