Design and Demonstration of a 2.5-D Glass Interposer BGA Package for High Bandwidth and Low Cost
Sawyer, Brett M. D., Suzuki, Yuya, Furuya, Ryuta, Nair, Chandrasekharan, Ting-Chia Huang, Smet, Vanessa, Panayappan, Kadappan, Sundaram, Venky, Tummala, Rao
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.04.2017)
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.04.2017)
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Journal Article
Design, Modeling, Fabrication and Characterization of 2-5- \mu \text Redistribution Layer Traces by Advanced Semiadditive Processes on Low-Cost Panel-Based Glass Interposers
Hao Lu, Furuya, Ryuta, Sawyer, Brett M. D., Nair, Chandrasekharan, Fuhan Liu, Sundaram, Venky, Tummala, Rao R.
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.06.2016)
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.06.2016)
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Journal Article
Demonstration of Fan-out Silicon Photonics Module for Next Generation Co-Packaged Optics (CPO) Application
Chou, Bruce, Sawyer, Brett M., Lyu, Gap, Timurdugan, Erman, Minkenberg, Cyriel, Zilkie, Aaron J., McCann, David
Published in 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) (01.05.2022)
Published in 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) (01.05.2022)
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Conference Proceeding
Design, Modeling, Fabrication and Characterization of 2-5-[Formula Omitted] Redistribution Layer Traces by Advanced Semiadditive Processes on Low-Cost Panel-Based Glass Interposers
Lu, Hao, Furuya, Ryuta, Sawyer, Brett M D, Nair, Chandrasekharan, Liu, Fuhan, Sundaram, Venky, Tummala, Rao R
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.06.2016)
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.06.2016)
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Journal Article