Compact 5G N77 bandpass filter design mixing IPD and MIS technologies
Laporte, C., Schwartz, L., Saugier, E., Charley, S., Ezzeddine, H.
Published in 2022 52nd European Microwave Conference (EuMC) (27.09.2022)
Published in 2022 52nd European Microwave Conference (EuMC) (27.09.2022)
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Conference Proceeding
New challenges and opportunities for 3D integrations
Michailos, J., Coudrain, P., Farcy, A., Hotellier, N., Cheramy, S., Lhostis, S., Deloffre, E., Sanchez, Y., Jouve, A., Guyader, F., Saugier, E., Fiori, V., Vivet, P., Vinet, M., Fenouillet-Beranger, C., Casset, F., Batude, P., Breuf, F., Henrion, Y., Vianne, B., Collin, L.-M, Colonna, J.-P, Benaissa, L., Brunet, L., Prieto, R., Velard, R., Ponthenier, F.
Published in 2015 IEEE International Electron Devices Meeting (IEDM) (01.12.2015)
Published in 2015 IEEE International Electron Devices Meeting (IEDM) (01.12.2015)
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Journal Article
Development and characterisation of a 3D technology including TSV and Cu pillars for high frequency applications
Charbonnier, J, Hida, R, Henry, D, Cheramy, S, Chausse, P, Neyret, M, Hajji, O, Garnier, G, Brunet-Manquat, C, Haumesser, P H, Vandroux, L, Anciant, R, Sillon, N, Farcy, A, Rousseau, M, Cuzzocrea, J, Druais, G, Saugier, E
Published in 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC) (01.06.2010)
Published in 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC) (01.06.2010)
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Conference Proceeding
TSV as an alternative to wire bonding for a wireless industrial product: another step towards 3D integration
Druais, G, Ancey, P, Chapelon, L L, Charbonnier, J, Cheramy, S, Dodo, Y, Farcy, A, Garnier, G, Guillou, Y, Henry, D, Leduc, P, Pruvost, J, Saugier, E, Sillon, N
Published in 3rd Electronics System Integration Technology Conference ESTC (01.09.2010)
Published in 3rd Electronics System Integration Technology Conference ESTC (01.09.2010)
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Conference Proceeding
HDI organic technology integrating built-in antennas dedicated to 60 GHz SiP solution
Pilard, R., Titz, D., Gianesello, F., Calascibetta, P., Riviere, J. M., Lopez, J., Coffy, R., Saugier, E., Poulain, A., Ferrero, F., Luxey, C., Brachat, P., Jacquemod, G., Gloria, D.
Published in Proceedings of the 2012 IEEE International Symposium on Antennas and Propagation (01.07.2012)
Published in Proceedings of the 2012 IEEE International Symposium on Antennas and Propagation (01.07.2012)
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Conference Proceeding
Towards efficient and reliable 300mm 3D technology for wide I/O interconnects
Coudrain, P., Colonna, J.-P, Aumont, C., Garnier, G., Chausse, P., Segaud, R., Vial, K., Jouve, A., Mourier, T., Magis, T., Besson, P., Gabette, L., Brunet-Manquat, C., Allouti, N., Laviron, C., Cheramy, S., Saugier, E., Pruvost, J., Farcy, A., Hotellier, N.
Published in 2012 IEEE 14th Electronics Packaging Technology Conference (EPTC) (01.12.2012)
Published in 2012 IEEE 14th Electronics Packaging Technology Conference (EPTC) (01.12.2012)
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Conference Proceeding
3D integration technology for set-top box application
Henry, D., Cheramy, S., Charbonnier, J., Chausse, P., Neyret, M., Brunet-Manquat, C., Verrun, S., Sillon, N., Bonnot, L., Gagnard, X., Saugier, E.
Published in 2009 IEEE International Conference on 3D System Integration (01.09.2009)
Published in 2009 IEEE International Conference on 3D System Integration (01.09.2009)
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Conference Proceeding
3D integration demonstration of a wireless product with design partitioning
Druais, G., Ancey, P., Aumont, C., Caubet, V., Chapelon, L-L, Chaton, C., Cheramy, S., Cordova, S., Cirot, E., Colonna, J-P, Coudrain, P., Divel, T., Dodo, Y., Farcy, A., Guitard, N., Haxaire, K., Hotellier, N., Leverd, F., Liou, R., Michailos, J., Ostrovsky, A., Petitdidier, S., Pruvost, J., Riquet, D., Robin, O., Saugier, E., Sillon, N.
Published in 2011 IEEE International 3D Systems Integration Conference (3DIC), 2011 IEEE International (01.01.2012)
Published in 2011 IEEE International 3D Systems Integration Conference (3DIC), 2011 IEEE International (01.01.2012)
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Conference Proceeding
Development and characterisation of high electrical performances TSV for 3D applications
Henry, D., Cheramy, S., Charbonnier, J., Chausse, P., Neyret, M., Garnier, G., Brunet-Manquat, C., Verrun, S., Sillon, N., Bonnot, L., Farcy, A., Cadix, L., Rousseau, M., Saugier, E.
Published in 2009 11th Electronics Packaging Technology Conference (01.12.2009)
Published in 2009 11th Electronics Packaging Technology Conference (01.12.2009)
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